ZHCSN30C December   2020  – March 2022 LMP7704-SP

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = 5 V
    6. 6.6 Electrical Characteristics: VS = 10 V
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Radiation Hardened Performance
      2. 7.3.2 Engineering Model (Devices With /EM Suffix)
      3. 7.3.3 Capacitive Load
      4. 7.3.4 Input Capacitance
      5. 7.3.5 Diodes Between the Inputs
    4. 7.4 Device Functional Modes
      1. 7.4.1 Precision Current Source
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Low Input Voltage Noise
      2. 8.1.2 Total Noise Contribution
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) LMP7704-SP UNIT
HBH (CFP)
14 PINS
RθJA Junction-to-ambient thermal resistance 37.5 ºC/W
RθJC(top) Junction-to-case(top) thermal resistance 20.6 ºC/W
RθJB Junction-to-board thermal resistance 21.3 ºC/W
ψJT Junction-to-top characterization parameter 12.9 ºC/W
ψJB Junction-to-board characterization parameter 21.0 ºC/W
RθJC(bot) Junction-to-case(bottom) thermal resistance 10.8 ºC/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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