6.3 Electrical Characteristics
Specifications with standard typeface are for TJ = 25°C, and those in boldface type apply over the full Operating Temperature Range (TJ = -40°C to 125°C). VIN = 5 V, VBOOST - VSW = 5V unless otherwise specified. Datasheet min/max specification limits are specified by design, test, or statistical analysis.
| PARAMETER |
TEST CONDITIONS |
MIN(4) |
TYP(5) |
MAX(4) |
UNIT |
| VFB |
Feedback Voltage |
|
0.784 |
0.800 |
0.816 |
V |
| ΔVFB/ΔVIN |
Feedback Voltage Line Regulation |
VIN = 3V to 20V |
|
0.01 |
|
% / V |
| IFB |
Feedback Input Bias Current |
Sink/Source |
|
10 |
250 |
nA |
| UVLO |
Undervoltage Lockout |
VIN Rising |
|
2.74 |
2.90 |
V |
| Undervoltage Lockout |
VIN Falling |
2.0 |
2.3 |
|
| UVLO Hysteresis |
|
0.30 |
0.44 |
0.62 |
| FSW |
Switching Frequency |
LMR12010X |
1.2 |
1.6 |
1.9 |
MHz |
| LMR12010Y |
2.2 |
3.0 |
3.6 |
| DMAX |
Maximum Duty Cycle |
LMR12010X |
85% |
92% |
|
|
| LMR12010Y |
78% |
85% |
|
| DMIN |
Minimum Duty Cycle |
LMR12010X |
|
2% |
|
|
| LMR12010Y |
|
8% |
|
| RDS(ON) |
Switch ON Resistance |
VBOOST - VSW = 3V |
|
300 |
600 |
mΩ |
| ICL |
Switch Current Limit |
VBOOST - VSW = 3V |
1.2 |
1.7 |
2.5 |
A |
| IQ |
Quiescent Current |
Switching |
|
1.5 |
2.5 |
mA |
| Quiescent Current (shutdown) |
VEN = 0V |
|
30 |
|
nA |
| IBOOST |
Boost Pin Current |
LMR12010X (50% Duty Cycle) |
|
2.5 |
3.5 |
mA |
| LMR12010Y (50% Duty Cycle) |
|
4.25 |
6.0 |
| VEN_TH |
Shutdown Threshold Voltage |
VEN Falling |
|
|
0.4 |
V |
| Enable Threshold Voltage |
VEN Rising |
1.8 |
|
|
| IEN |
Enable Pin Current |
Sink/Source |
|
10 |
|
nA |
| ISW |
Switch Leakage |
|
|
40 |
|
nA |
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended operating ratings indicate conditions for which the device is intended to be functional, but specific performance is not verified. For verified specifications and the test conditions, see
Electrical Characteristics
(2) Human body model, 1.5kΩ in series with 100pF.
(3) Thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of TJ(MAX) , θJA and TA . The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/θJA . All numbers apply for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. For a 2 layer board using 1 oz. copper in still air, θJA = 204°C/W.
(4) Specified to Average Outgoing Quality Level (AOQL).
(5) Typicals represent the most likely parametric norm.