ZHCSFR2B December   2016  – March 2018 LMR23630-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
      2.      效率与负载间的关系，VIN = 12V，PFM 选项
  4. 4 修订历史记录
  5. 5 Product Portfolio
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed-Frequency Peak-Current-Mode Control
      2. 8.3.2  Adjustable Frequency
      3. 8.3.3  Adjustable Output Voltage
      4. 8.3.4  Enable/Synchronization
      5. 8.3.5  VCC, UVLO
      6. 8.3.6  Minimum ON-time, Minimum OFF-time and Frequency Foldback at Dropout Conditions
      7. 8.3.7  Power Good (PGOOD)
      8. 8.3.8  Internal Compensation and CFF
      9. 8.3.9  Bootstrap Voltage (BOOT)
      10. 8.3.10 Overcurrent and Short-Circuit Protection
      11. 8.3.11 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
      3. 8.4.3 CCM Mode
      4. 8.4.4 Light Load Operation (PFM Option)
      5. 8.4.5 Light Load Operation (FPWM Option)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design With WEBENCH® Tools
        2. 9.2.2.2  Output Voltage Setpoint
        3. 9.2.2.3  Switching Frequency
        4. 9.2.2.4  Inductor Selection
        5. 9.2.2.5  Output Capacitor Selection
        6. 9.2.2.6  Feed-Forward Capacitor
        7. 9.2.2.7  Input Capacitor Selection
        8. 9.2.2.8  Bootstrap Capacitor Selection
        9. 9.2.2.9  VCC Capacitor Selection
        10. 9.2.2.10 UVLO Setpoint
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Compact Layout for EMI Reduction
      2. 11.1.2 Ground Plane and Thermal Considerations
      3. 11.1.3 Feedback Resistors
    2. 11.2 Layout Examples
  12. 12器件和文档支持
    1. 12.1 使用 WEBENCH® 工具创建定制设计
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from A Revision (April 2017) to B Revision

  • 在 12 引脚 WSON 中添加了“可湿”一词Go
  • 删除了“汽车电池稳压、工业电源、电信和数据通信系统”并修改了“应用”中的措辞Go
  • Deleted 针对市场发布从 WSON 内容中删除了“预览”；对格式进行了编辑性更新Go
  • Updating the the drawing title for Pin Configurations and Functions for WSON with RT and WSON with PGOOD Go
  • Corrected the column title for WSON with RT and WSON with PGOOD Go
  • Updating the ESD Ratings to include both SOIC and WSON packagesGo
  • Changing from EN Pin to EN/SYNC Pin Go
  • Added WSON only on the Electrical Characteristic table for PGOODGo
  • Changing the minimum value for VPG_OV from 105% to 104% Go
  • Adding a row for WSON Peak and Valley inductor current limitGo
  • Changed the min and max for minimum adjustable frequency from 180kHz and 220kHz to 150kHz and 250kHzGo
  • Changed the min,typ, and max values for maximum adjustable frequency from 1980kHz,2200kHz, and 2420kHz to 1750kHz,2150kHz and 2425kHzGo

Changes from * Revision (December 2016) to A Revision

  • Changed the ESD HBM rating to ±2000 from ±2500Go
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