ZHCSF93E December 2015 – August 2020 LMR23630
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Fixed Frequency Peak Current Mode Control
- 8.3.2 Adjustable Frequency
- 8.3.3 Adjustable Output Voltage
- 8.3.4 Enable/Sync
- 8.3.5 VCC, UVLO
- 8.3.6 Minimum ON-time, Minimum OFF-time and Frequency Foldback at Dropout Conditions
- 8.3.7 Power Good (PGOOD)
- 8.3.8 Internal Compensation and CFF
- 8.3.9 Bootstrap Voltage (BOOT)
- 8.3.10 Overcurrent and Short-Circuit Protection
- 8.3.11 Thermal Shutdown
- 8.4 Device Functional Modes
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Applications
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Custom Design With WEBENCH® Tools
- 9.2.2.2 Output Voltage Setpoint
- 9.2.2.3 Switching Frequency
- 9.2.2.4 Inductor Selection
- 9.2.2.5 Output Capacitor Selection
- 9.2.2.6 Feed-Forward Capacitor
- 9.2.2.7 Input Capacitor Selection
- 9.2.2.8 Bootstrap Capacitor Selection
- 9.2.2.9 VCC Capacitor Selection
- 9.2.2.10 Undervoltage Lockout Setpoint
- 9.2.3 Application Curves
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
- DRR|12
- DDA|8
散热焊盘机械数据 (封装 | 引脚)
订购信息
12.5 静电放电警告
 |
静电放电 (ESD) 会损坏这个集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。 |
| ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。 |