ZHCSIN5D August   2018  – August 2022 LMR36006-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 System Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Flag Output
      2. 8.3.2 Enable and Start-up
      3. 8.3.3 Current Limit and Short Circuit
      4. 8.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Forced PWM Operation
      3. 8.4.3 Dropout
      4. 8.4.4 Minimum Switch On-Time
      5. 8.4.5 Spread Spectrum Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design 1: Low Power 24-V, 600-mA PFM Converter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Custom Design With WEBENCH Tools
          2. 9.2.1.2.2  Choosing the Switching Frequency
          3. 9.2.1.2.3  Setting the Output Voltage
            1. 9.2.1.2.3.1 FB for Adjustable Output
          4. 9.2.1.2.4  Inductor Selection
          5. 9.2.1.2.5  Output Capacitor Selection
          6. 9.2.1.2.6  Input Capacitor Selection
          7. 9.2.1.2.7  CBOOT
          8. 9.2.1.2.8  VCC
          9. 9.2.1.2.9  CFF Selection
            1. 9.2.1.2.9.1 External UVLO
          10. 9.2.1.2.10 Maximum Ambient Temperature
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Design 2: High Density 12-V , 600-mA FPWM Converter
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision C (October 2019) to Revision D (August 2022)

  • 更新了整个文档中的表格、图和交叉参考的编号格式。Go
  • Section 1 添加了功能安全要点Go
  • Included LMR36006BQRNXRQ1 in the Device Comparison Table. Go

Changes from Revision B (February 2019) to Revision C (October 2019)