ZHCSI00D April   2018  – September 2020 LMR36015

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 System Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Power-Good Flag Output
      2. 9.3.2 Enable and Start-up
      3. 9.3.3 Current Limit and Short Circuit
      4. 9.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Auto Mode
      2. 9.4.2 Forced PWM Operation
      3. 9.4.3 Dropout
      4. 9.4.4 Minimum Switch On-Time
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design 1: Low Power 24-V, 1.5-A PFM Converter
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1  Custom Design With WEBENCH Tools
          2. 10.2.1.2.2  Choosing the Switching Frequency
          3. 10.2.1.2.3  Setting the Output Voltage
          4. 10.2.1.2.4  Inductor Selection
          5. 10.2.1.2.5  Output Capacitor Selection
          6. 10.2.1.2.6  Input Capacitor Selection
          7. 10.2.1.2.7  CBOOT
          8. 10.2.1.2.8  VCC
          9. 10.2.1.2.9  CFF Selection
            1. 10.2.1.2.9.1 External UVLO
          10. 10.2.1.2.10 Maximum Ambient Temperature
      2. 10.2.2 Application Curves
      3. 10.2.3 Design 2: High Density 24-V, 1.5-A FPWM Converter
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curves
    3. 10.3 What to Do and What Not to Do
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Ground and Thermal Considerations
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
        1. 13.1.1.1 Custom Design With WEBENCH® Tools
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 接收文档更新通知
    4. 13.4 支持资源
    5. 13.5 Trademarks
    6. 13.6 静电放电警告
    7. 13.7 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM)(1)±2500V
V(ESD)Electrostatic dischargeCharged-device model (CDM)(2)±750V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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