For related documentation see the following:
- Texas Instruments, Thermal Design by Insight not Hindsight Application Report
- Texas Instruments, A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages Application Report
- Texas Instruments, Semiconductor and IC Package Thermal Metrics Application Report
- Texas Instruments, Thermal Design Made Simple with LM43603 and LM43602 Application Report
- Texas Instruments, PowerPAD™ Thermally Enhanced Package Application Report
- Texas Instruments, PowerPAD™ Made Easy Application Report
- Texas Instruments, Using New Thermal Metrics Application Report
- Texas Instruments, Layout Guidelines for Switching Power Supplies Application Report
- Texas Instruments, Simple Switcher PCB Layout Guidelines Application Report
- Texas Instruments, Construction Your Power Supply- Layout Considerations Seminar
- Texas Instruments, Low Radiated EMI Layout Made Simple with LM4360x and LM4600x Application Report