ZHCSKN9B December   2019  – December 2022 LMR36506

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD (Commercial) Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 System Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Enable, Start-up, and Shutdown
      2. 8.3.2  Adjustable Switching Frequency (with RT)
      3. 8.3.3  Power-Good Output Operation
      4. 8.3.4  Internal LDO, VCC UVLO, and VOUT/BIAS Input
      5. 8.3.5  Bootstrap Voltage and VCBOOT-UVLO (CBOOT Terminal)
      6. 8.3.6  Output Voltage Selection
      7. 8.3.7  Soft Start and Recovery from Dropout
        1. 8.3.7.1 Recovery from Dropout
      8. 8.3.8  Current Limit and Short Circuit
      9. 8.3.9  Thermal Shutdown
      10. 8.3.10 Input Supply Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
        1. 8.4.3.1 CCM Mode
        2. 8.4.3.2 Auto Mode - Light Load Operation
          1. 8.4.3.2.1 Diode Emulation
          2. 8.4.3.2.2 Frequency Reduction
        3. 8.4.3.3 FPWM Mode - Light Load Operation
        4. 8.4.3.4 Minimum On-time (High Input Voltage) Operation
        5. 8.4.3.5 Dropout
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Choosing the Switching Frequency
        2. 9.2.2.2 Setting the Output Voltage
          1. 9.2.2.2.1 FB for Adjustable Output
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Input Capacitor Selection
        6. 9.2.2.6 CBOOT
        7. 9.2.2.7 VCC
        8. 9.2.2.8 CFF Selection
          1. 9.2.2.8.1 External UVLO
        9. 9.2.2.9 Maximum Ambient Temperature
      3. 9.2.3 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
        1. 9.5.1.1 Ground and Thermal Considerations
      2. 9.5.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

The value of RθJA given in this table is only valid for comparison with other packages and cannot be used for design purposes. These values were calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. They do not represent the performance obtained in an actual application. For example, with a 4-layer PCB, a RθJA= 58℃/W can be achieved
THERMAL METRIC(1) LMR36506 UNIT
VQFN (RPE)
9 Pins
RθJA Junction-to-ambient thermal resistance 84.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47.5 °C/W
RθJB Junction-to-board thermal resistance 26.1 °C/W
ΨJT Junction-to-top characterization parameter 0.9 °C/W
ΨJB Junction-to-board characterization parameter 25.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.  The value of RΘJA given in this table is only valid for comparison with other packages and can not be used for design purposes. This value was calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. It does not represent the performance obtained in an actual application. For design information see the  Maximum Ambient Temperature section.
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