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ZHCSN38D October 2021 – April 2024 LMR54406 , LMR54410

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

DBV|6
- MPDS026Q

散热焊盘机械数据 (封装 | 引脚)

订购信息

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LMR544XX	UNIT
		DBV(SOT-23-6)
		6 PINS
R_θJA⁽²⁾	Junction-to-ambient thermal resistance	173	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	116	°C/W
R_θJB	Junction-to-board thermal resistance	31	°C/W
ψ_JT	Junction-to-top characterization parameter	20	°C/W
ψ_JB	Junction-to-board characterization parameter	30	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) The value of RθJA given in this table is only valid for comparison with other packages and cannot be used for design
purposes. These values were calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. They do
not represent the performance obtained in an actual application. For example, with a 2-layer PCB, a RθJA = 80℃/W can be
achieved. For design information see Maximum Output Current versus Ambient Temperature.