ZHCSKP5D june   2020  – april 2023 LMV321A-Q1 , LMV324A-Q1 , LMV358A-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: LMV321A-Q1
    5. 6.5 Thermal Information: LMV358A-Q1
    6. 6.6 Thermal Information: LMV324A-Q1
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Common Mode Range
      3. 7.3.3 Rail-to-Rail Output
      4. 7.3.4 Overload Recovery
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 LMV3xxA-Q1 Low-Side, Current Sensing Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Single-Supply Photodiode Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Input and ESD Protection
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Thermal Information: LMV324A-Q1

THERMAL METRIC(1) LMV324A-Q1 UNIT
D (SOIC) PW (TSSOP) DYY (SOT-23)
14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 115.1 135.3 154.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 71.2 63.5 86.8 °C/W
RθJB Junction-to-board thermal resistance 71.1 78.4 67.9 °C/W
ψJT Junction-to-top characterization parameter 29.6 13.6 10.1 °C/W
ψJB Junction-to-board characterization parameter 70.7 77.9 67.5 °C/W
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