ZHCSDH8 March   2015 LMX2571

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Reference Oscillator Input
      2. 7.3.2  R-Dividers and Multiplier
      3. 7.3.3  PLL Phase Detector and Charge Pump
      4. 7.3.4  PLL N-Divider and Fractional Circuitry
      5. 7.3.5  Partially Integrated Loop Filter
      6. 7.3.6  Low-Noise, Fully Integrated VCO
      7. 7.3.7  External VCO Support
      8. 7.3.8  Programmable RF Output Divider
      9. 7.3.9  Programmable RF Output Buffer
      10. 7.3.10 Integrated TX, RX Switch
      11. 7.3.11 Powerdown
      12. 7.3.12 Lock Detect
      13. 7.3.13 FSK Modulation
      14. 7.3.14 FastLock
      15. 7.3.15 Register Readback
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation Mode
      2. 7.4.2 Duplex Mode
      3. 7.4.3 FSK Mode
    5. 7.5 Programming
      1. 7.5.1 Recommended Initial Power on Programming Sequence
      2. 7.5.2 Recommended Sequence for Changing Frequencies
    6. 7.6 Register Maps
      1. 7.6.1  R60 Register (offset = 3Ch) [reset = 4000h]
      2. 7.6.2  R58 Register (offset = 3Ah) [reset = C00h]
      3. 7.6.3  R53 Register (offset = 35h) [reset = 2802h]
      4. 7.6.4  R47 Register (offset = 2Fh) [reset = 0h]
      5. 7.6.5  R42 Register (offset = 2Ah) [reset = 210h]
      6. 7.6.6  R41 Register (offset = 29h) [reset = 810h]
      7. 7.6.7  R40 Register (offset = 28h) [reset = 101Ch]
      8. 7.6.8  R39 Register (offset = 27h) [reset = 11F0h]
      9. 7.6.9  R35 Register (offset = 23h) [reset = 647h]
      10. 7.6.10 R34 Register (offset = 22h) [reset = 1000h]
      11. 7.6.11 R33 Register (offset = 21h) [reset = 0h]
      12. 7.6.12 R25 to R32 Register (offset = 19h to 20h) [reset = 0h]
      13. 7.6.13 R24 Register (offset = 18h) [reset = 10h]
      14. 7.6.14 R23 Register (offset = 17h) [reset = 10A4h]
      15. 7.6.15 R22 Register (offset = 16h) [reset = 8584h]
      16. 7.6.16 R21 Register (offset = 15h) [reset = 101h]
      17. 7.6.17 R20 Register (offset = 14h) [reset = 28h]
      18. 7.6.18 R19 Register (offset = 13h) [reset = 0h]
      19. 7.6.19 R18 Register (offset = 12h) [reset = 0h]
      20. 7.6.20 R17 Register (offset = 11h) [reset = 0h]
      21. 7.6.21 R9 to R16 Register (offset = 9h to 10h) [reset = 0h]
      22. 7.6.22 R8 Register (offset = 8h) [reset = 10h]
      23. 7.6.23 R7 Register (offset = 7h) [reset = 10A4h]
      24. 7.6.24 R6 Register (offset = 6h) [reset = 8584h]
      25. 7.6.25 R5 Register (offset = 5h) [reset = 101h]
      26. 7.6.26 R4 Register (offset = 4h) [reset = 28h]
      27. 7.6.27 R3 Register (offset = 3h) [reset = 0h]
      28. 7.6.28 R2 Register (offset = 2h) [reset = 0h]
      29. 7.6.29 R1 Register (offset = 1h) [reset = 0h]
      30. 7.6.30 R0 Register (offset = 0h) [reset = 3h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Direct Digital FSK Modulation
      2. 8.1.2  Frequency and Output Port Switching with TrCtl Pin
      3. 8.1.3  OSCin Configuration
      4. 8.1.4  Register R0 F1F2_INIT, F1F2_MODE usage
      5. 8.1.5  FastLock with External VCO
      6. 8.1.6  OSCin Slew Rate
      7. 8.1.7  RF Output Buffer Power Control
      8. 8.1.8  RF Output Buffer Type
      9. 8.1.9  MULT Multiplier
      10. 8.1.10 Integrated VCO
    2. 8.2 Typical Applications
      1. 8.2.1 Synthesizer Duplex Mode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Synthesizer Duplex Mode Application Curves
      2. 8.2.2 PLL Duplex Mode
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 PLL Duplex Mode Application Curves
      3. 8.2.3 Synthesizer/PLL Duplex Mode
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Synthesizer/PLL Duplex Mode Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
  • NJK|36
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Layout

10.1 Layout Guidelines

See EVM instructions for details. In general, the layout guidelines are similar to most other PLL devices. The followings are some guidelines specific to the device.

  • It may be beneficial to separate main ground and OSCin ground, crosstalk spurs might be reduced.
  • Don't route any traces that carry switching signal close to the charge pump traces and external VCO.
  • When using FSK I2S mode on this device, care should be taken to avoid coupling between the I2S clock and any of the PLL circuit.

10.2 Layout Example

LMX2571 11_layout_SNAS654.pngFigure 86. Layout Example
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