ZHCS586H October   2011  – October 2023 LMZ10500

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Start-up Behavior and Soft Start
      3. 7.3.3 Output Short Circuit Protection
      4. 7.3.4 Thermal Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Circuit Operation
      2. 7.4.2 Input Undervoltage Detection
      3. 7.4.3 Shutdown Mode
      4. 7.4.4 EN Pin Operation
      5. 7.4.5 Internal Synchronous Rectification
      6. 7.4.6 High Duty Cycle Operation
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting the Output Voltage
          1. 8.2.2.2.1 RT and RB Selection for Fixed VOUT
          2. 8.2.2.2.2 Output Voltage Accuracy Optimization
        3. 8.2.2.3 Dynamic Output Voltage Scaling
        4. 8.2.2.4 Integrated Inductor
        5. 8.2.2.5 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
        1. 8.2.3.1 VOUT = 1.2 V
        2. 8.2.3.2 VOUT = 1.8 V
        3. 8.2.3.3 VOUT = 2.5 V
        4. 8.2.3.4 VOUT = 3.3 V
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Voltage Range
      2. 8.3.2 Current Capability
      3. 8.3.3 Input Connection
        1. 8.3.3.1 Voltage Drops
        2. 8.3.3.2 Stability
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Package Considerations
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • SIL|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

LMZ10500 微型模块采用易用型直流/直流降压设计,可在空间受限的应用中驱动高达 650mA 的负载。该器件仅需使用一个输入电容、一个输出电容、一个小型 VCON 滤波电容和两个电阻即可实现基本运行。该微型模块采用 8 引脚 µSiP 封装,配备集成电感器。还提供基于内部电流限制的软启动功能、电流过载保护和热关断功能。

封装信息
器件型号封装(1)封装尺寸(2)
LMZ10500SIL(µSiP,8)3.00mm × 2.60mm
如需了解所有可用封装,请参阅数据表末尾的可订购米6体育平台手机版_好二三四附录。
封装尺寸(长 × 宽)为标称值,并包括引脚(如适用)。
GUID-93F7AA6E-2E9B-499F-A45C-E5E3C20D377D-low.pngVIN = 3.6V 时的典型效率
GUID-5D0E3396-CDB5-4B52-A1AB-7FA69C613D0C-low.png辐射电磁干扰 (EMI) (CISPR22) VIN = 5V、VOUT = 1.8V、IOUT = 650mA