ZHCS567J June   2010  – April 2019 LMZ10503EXT

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路
      2.      效率 (VOUT = 3.3V)
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Enable and UVLO
      3. 7.3.3 Soft-Start
      4. 7.3.4 Soft-Start Capacitor
      5. 7.3.5 Tracking
      6. 7.3.6 Tracking - Equal Soft-Start Time
      7. 7.3.7 Tracking - Equal Slew Rates
      8. 7.3.8 Current Limit
      9. 7.3.9 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Prebias Start-Up Capability
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Output Capacitor Selection
          1. 8.2.2.3.1 Output Voltage Setting
        4. 8.2.2.4 Loop Compensation
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Application Schematic for 3.3-V to 5-V Input and 2.5-V Output With Optimized Ripple and Transient Response
      2. 8.3.2 Application Schematic for 3.3-V to 5-V Input and 2.5-V Output
      3. 8.3.3 EMI Tested Schematic for 2.5-V Output Based on 3.3-V to 5-V Input
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Estimate Power Dissipation and Thermal Considerations
    4. 10.4 Power Module SMT Guidelines
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 11.1.2 开发支持
        1. 11.1.2.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.4 Power Module SMT Guidelines

The recommendations below are for a standard module surface mount assembly

  • Land Pattern – Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads
  • Stencil Aperture
    • For the exposed die attach pad (DAP), adjust the stencil for approximately 80% coverage of the PCB land pattern
    • For all other I/O pads use a 1:1 ratio between the aperture and the land pattern recommendation
  • Solder Paste – Use a standard SAC Alloy such as SAC 305, type 3 or higher
  • Stencil Thickness – 0.125 to 0.15 mm
  • Reflow - Refer to solder paste supplier recommendation and optimized per board size and density
  • Maximum number of reflows allowed is one
  • Refer to AN Design Summary LMZ1xxx and LMZ2xxx Power Modules Family (SNAA214) for reflow information.
LMZ10503EXT reflow_chart_snvs632.pngFigure 35. Sample Reflow Profile

Table 11. Sample Reflow Profile Table

PROBE MAX TEMP (°C) REACHED MAX TEMP TIME ABOVE 235°C REACHED 235°C TIME ABOVE 245°C REACHED 245°C TIME ABOVE 260°C REACHED 260°C
1 242.5 6.58 0.49 6.39 0.00 – 0.00 –
2 242.5 7.10 0.55 6.31 0.00 7.10 0.00 –
3 241.0 7.09 0.42 6.44 0.00 – 0.00 –
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