SNVS650H January   2010  – August 2015 LMZ12002

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 COT Control Circuit Overview
      2. 7.3.2 Output Overvoltage Comparator
      3. 7.3.3 Current Limit
      4. 7.3.4 Thermal Protection
      5. 7.3.5 Zero Coil Current Detection
      6. 7.3.6 Prebiased Start-Up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Discontinuous Conduction and Continuous Conduction Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Enable Divider, RENT and RENB Selection
        2. 8.2.2.2 Output Voltage Selection
        3. 8.2.2.3 Soft-Start Capacitor Selection
        4. 8.2.2.4 CO Selection
        5. 8.2.2.5 CIN Selection
        6. 8.2.2.6 RON Resistor Selection
        7. 8.2.2.7 Discontinuous Conduction and Continuous Conduction Modes Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Power Dissipation and Thermal Considerations
    4. 10.4 Power Module SMT Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

6 Specifications

6.1 Absolute Maximum Ratings(1)(2)(3)

MIN MAX UNIT
VIN, RON to GND –0.3 25 V
EN, FB, SS to GND –0.3 7 V
Junction Temperature 150 °C
Peak Reflow Case Temperature (30 sec) 245 °C
Storage Temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) For soldering specifications, refer to the following document: SNOA549

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. Test method is per JESD-22-114.

6.3 Recommended Operating Conditions(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN 4.5 20 V
EN 0 6.5 V
Operation Junction Temperature –40 125 °C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.

6.4 Thermal Information

THERMAL METRIC(1) LMZ12002 UNIT
NDW
7 PINS
RθJA Junction-to-ambient thermal resistance (2) 4-layer JEDEC Printed-Circuit-Board, 100 vias, No air flow 19.3 °C/W
2-layer JEDEC Printed-Circuit-Board, No air flow 21.5
RθJC(top) Junction-to-case (top) thermal resistance No air flow 1.9 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) RθJA measured on a 1.705-in × 3.0-in 4-layer board, with 1-oz. copper, thirty five thermal vias, no air flow, and 1-W power dissipation. Refer to PCB layout diagrams.

6.5 Electrical Characteristics

Limits are for TJ = 25°C unless otherwise specified. Minimum and Maximum limits are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 12 V, VOUT = 1.8 V(3).
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
SYSTEM PARAMETERS
ENABLE CONTROL
VEN EN threshold trip point VEN rising 1.18 V
over the junction temperature (TJ) range of -40°C to +125°C 1.1 1.25
VEN-HYS EN threshold hysteresis VEN falling 90 mV
SOFT-START
ISS SS source current VSS = 0 V 8 µA
over the junction temperature (TJ) range of -40°C to +125°C 5 11
ISS-DIS SS discharge current –200 µA
CURRENT LIMIT
ICL Current limit threshold DC average 2.6 A
over the junction temperature (TJ) range of -40°C to +125°C 2.3 3.65
ON/OFF TIMER
tON-MIN ON timer minimum pulse width 150 ns
tOFF OFF timer pulse width 260 ns
REGULATION AND OVERVOLTAGE COMPARATOR
VFB In-regulation feedback voltage VSS >+ 0.8 V
TJ = -40°C to 125°C
IO = 2 A		 0.795 V
over the junction temperature (TJ) range of -40°C to +125°C 0.775 0.815
VSS >+ 0.8 V
TJ = 25°C
IO = 10 mA		 0.784 0.8 0.816
VFB-OV Feedback overvoltage protection threshold 0.92 V
IFB Feedback input bias current 5 nA
IQ Non-switching input current VFB= 0.86 V 1 mA
ISD Shutdown quiescent current VEN= 0 V 25 μA
THERMAL CHARACTERISTICS
TSD Thermal shutdown Rising 165 °C
TSD-HYST Thermal shutdown hysteresis Falling 15 °C
PERFORMANCE PARAMETERS
ΔVO Output voltage ripple 8 mVPP
ΔVO/ΔVIN Line regulation VIN = 8 V to 20 V, IO= 2 A 0.01%
ΔVO/ΔVIN Load regulation VIN = 12 V 1.5 mV/A
η Efficiency VIN = 12 V, VO = 1.8 V, IO = 1 A 87%
VIN = 12 V, VO = 1.8 V, IO = 2 A 77%
(1) Minimum and Maximum limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely parametric norm.
(3) EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007. See AN-2024 and layout for information on device under test.

6.6 Typical Characteristics

Unless otherwise specified, the following conditions apply: VIN = 12 V; CIN = 10-µF X7R Ceramic; CO = 100-µF X7R Ceramic; TA = 25°C for efficiency curves and waveforms.
LMZ12002 30114751.gif
Figure 1. Efficiency 4.5-V Input at 25°C
LMZ12002 30114753.gif
Figure 3. Efficiency 5-V Input at 25°C
LMZ12002 30114721.gif
Figure 5. Efficiency 6-V Input at 25°C
LMZ12002 30114755.gif
Figure 7. Efficiency 8-V Input at 25°C
LMZ12002 30114703.gif
Figure 9. Efficiency 12-V Input at 25°C
LMZ12002 30114757.gif
Figure 11. Efficiency 20-V Input at 25°C
LMZ12002 30114759.gif
Figure 13. Efficiency 4.5-V Input at 85°C
LMZ12002 30114761.gif
Figure 15. Efficiency 5-V Input at 85°C
LMZ12002 30114733.gif
Figure 17. Efficiency 6-V Input at 85°C
LMZ12002 30114740.gif
Figure 19. Efficiency 8-V Input at 85°C
LMZ12002 30114742.gif
Figure 21. Efficiency 12-V Input at 85°C
LMZ12002 30114763.gif
Figure 23. Efficiency 20-V Input at 85°C
LMZ12002 30114748.gif
Figure 25. Line and Load Regulation at 25°C
LMZ12002 30114705.gif
Figure 27. Output Ripple 12 VIN 3.3 VO 2 A 20 mV/div 1 μs/div
LMZ12002 30114765.gif
Figure 29. Current Limit 1.8 VOUT at 25°C
LMZ12002 30114768.gif
Figure 31. Current Limit 3.3 VOUT at 85°C
LMZ12002 30114752.gif
Figure 2. Dissipation 4.5-V Input at 25°C
LMZ12002 30114754.gif
Figure 4. Dissipation 5-V Input at 25°C
LMZ12002 30114722.gif
Figure 6. Dissipation 6-V Input at 25°C
LMZ12002 30114756.gif
Figure 8. Dissipation 6-V Input at 25°C
LMZ12002 30114704.gif
Figure 10. Dissipation 12-V Input at 25°C
LMZ12002 30114758.gif
Figure 12. Dissipation 20-V Input at 25°C
LMZ12002 30114760.gif
Figure 14. Dissipation 4.5-V Input at 85°C
LMZ12002 30114762.gif
Figure 16. Dissipation 5-V Input at 85°C
LMZ12002 30114734.gif
Figure 18. Dissipation 6-V Input at 85°C
LMZ12002 30114741.gif
Figure 20. Dissipation 8-V Input at 85°C
LMZ12002 30114743.gif
Figure 22. Dissipation 12-V Input at 85°C
LMZ12002 30114764.gif
Figure 24. Dissipation 20-V Input at 85°C
LMZ12002 30114769.gif
Figure 26. Line and Load Regulation at 85°C
LMZ12002 30114706.gif
Figure 28. Transient Response 12 VIN 3.3 VO 0.6-A to 2-A Step
LMZ12002 30114767.gif
Figure 30. Current Limit 3.3 VOUT at 25°C
LMZ12002 30114749.gif
Figure 32. Thermal Derating VOUT = 1.8 V
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |