ZHCS548S December   2009  – July 2017 LMZ14203

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 COT Control Circuit Overview
      2. 7.3.2 Output Overvoltage Comparator
      3. 7.3.3 Current Limit
      4. 7.3.4 Thermal Protection
      5. 7.3.5 Zero Coil Current Detection
      6. 7.3.6 Prebiased Start-Up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Discontinuous Conduction and Continuous Conduction Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Design Steps for the LMZ14203 Application
          1. 8.2.2.2.1 Enable Divider, RENT and RENB Selection
          2. 8.2.2.2.2 Output Voltage Selection
          3. 8.2.2.2.3 Soft-Start Capacitor Selection
          4. 8.2.2.2.4 CO Selection
          5. 8.2.2.2.5 CIN Selection
          6. 8.2.2.2.6 Discontinuous Conduction and Continuous Conduction Mode Selection
          7. 8.2.2.2.7 RON Resistor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation and Board Thermal Requirements
    4. 10.4 Power Module SMT Guidelines
  11. 11器件和文档支持
    1. 11.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 器件支持
      1. 11.2.1 开发支持
      2. 11.2.2 Third-Party Products Disclaimer
    3. 11.3 文档支持
      1. 11.3.1 相关文档
    4. 11.4 接收文档更新通知
    5. 11.5 社区资源
    6. 11.6 商标
    7. 11.7 静电放电警告
    8. 11.8 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VIN, RON to GND –0.3 43.5 V
EN, FB, SS to GND –0.3 7 V
Junction Temperature 150 °C
Peak Reflow Case Temperature (30 sec) 245 °C
Storage Temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For soldering specifications, refer to the following document: Absolute Maximum Ratings for Soldering (SNOA549).

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN 6 42 V
EN 0 6.5 V
Operation Junction Temperature −40 125 °C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Ratings are conditions under which operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.

6.4 Thermal Information

THERMAL METRIC(1) LMZ14203 UNIT
NDW (TO-PMOD)
7 PINS
RθJA Junction-to-ambient thermal resistance 4-layer JEDEC Printed Circuit Board, No air flow 19.3 °C/W
2-layer JEDEC Printed Circuit Board, No air flow 21.5
RθJC(top) Junction-to-case (top) thermal resistance No air flow 1.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

TJ = 25°C unless otherwise noted. Minimum and maximum limits are ensured through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 24 V, Vout = 3.3 V
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
SYSTEM PARAMETERS
Enable Control(3)
VEN EN threshold trip point VEN rising TJ = 25°C 1.18 V
over the junction temperature (TJ) range of –40°C to +125°C 1.1 1.25
VEN-HYS EN threshold hysteresis VEN falling 90 mV
Soft Start
ISS SS source current VSS = 0V TJ = 25°C 8 µA
over the junction temperature (TJ) range of –40°C to +125°C 5 11
ISS-DIS SS discharge current –200 µA
Current Limit
ICL Current limit threshold DC average
VIN= 12 V to 24 V		 TJ = 25°C 4.2 A
over the junction temperature (TJ) range of –40°C to +125°C 3.2 5.25
ON/OFF Timer
tON-MIN ON timer minimum pulse width 150 ns
tOFF OFF timer pulse width 260 ns
Regulation and Overvoltage Comparator
VFB In-regulation feedback voltage VSS > 0.8 V
TJ = –40°C to 125°C
IO = 3 A		 TJ = 25°C 0.804 V
over the junction temperature (TJ) range of –40°C to +125°C 0.784 0.825
VSS > 0.8 V
TJ = 25°C
IO = 10 mA		 0.786 0.802 0.818 V
VFB-OV Feedback overvoltage protection threshold 0.92 V
IFB Feedback input bias current 5 nA
IQ Nonswitching Input Current VFB= 0.86 V 1 mA
ISD Shut Down Quiescent Current VEN= 0 V 25 μA
Thermal Characteristics
TSD Thermal Shutdown Rising 165 °C
TSD-HYST Thermal shutdown hysteresis Falling 15 °C
PERFORMANCE PARAMETERS
ΔVO Output Voltage Ripple 8 mV PP
ΔVO/ΔVIN Line Regulation VIN = 12 V to 42 V, IO= 3 A 0.01%
ΔVO/IOUT Load Regulation VIN = 24 V 1.5 mV/A
η Efficiency VIN = 24 V VO = 3.3 V IO = 1 A 92%
η Efficiency VIN = 24 V VO = 3.3 V IO = 3 A 85%
(1) Minimum and maximum limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely parametric norm.
(3) EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007. See AN-2024 and layout for information on device under test.

6.6 Typical Characteristics

Unless otherwise specified, the following conditions apply: VIN = 24 V; CIN = 10-µF X7R Ceramic; CO = 100-µF X7R Ceramic; TA = 25°C for efficiency curves and waveforms.
LMZ14203 30107031.gif
Figure 1. Efficiency 6-V Input at 25°C
LMZ14203 30107003.gif
Figure 3. Efficiency 12-V Input at 25°C
LMZ14203 30107026.gif
Figure 5. Efficiency 24-V Input at 25°C
LMZ14203 30107029.gif
Figure 7. Efficiency 36-V Input at 25°C
LMZ14203 30107033.gif
Figure 9. Efficiency 6-V Input at 85°C
LMZ14203 30107040.gif
Figure 11. Efficiency 8-V Input at 85°C
LMZ14203 30107042.gif
Figure 13. Efficiency 12-V Input at 85°C
LMZ14203 30107044.gif
Figure 15. Efficiency 24-V Input at 85°C
LMZ14203 30107046.gif
Figure 17. Efficiency 36-V Input at 85°C
LMZ14203 30107048.gif
Figure 19. Line and Load Regulation at 25°C
LMZ14203 30107006.png
Figure 21. Transient Response
24 VIN 3.3 VO 0.6-A to 3-A Step
LMZ14203 30107032.gif
Figure 2. Dissipation 6-V Input at 25°C
LMZ14203 30107004.gif
Figure 4. Dissipation 12-V Input at 25°C
LMZ14203 30107027.gif
Figure 6. Dissipation 24-V Input at 25°C
LMZ14203 30107030.gif
Figure 8. Dissipation 36-V Input at 25°C
LMZ14203 30107034.gif
Figure 10. Dissipation 6-V Input at 85°C
LMZ14203 30107041.gif
Figure 12. Dissipation 8-V Input at 85°C
LMZ14203 30107043.gif
Figure 14. Dissipation 12-V Input at 85°C
LMZ14203 30107045.gif
Figure 16. Dissipation 24-V Input at 85°C
LMZ14203 30107047.gif
Figure 18. Dissipation 36-V Input at 85°C
LMZ14203 30107005.png
Figure 20. Output Ripple
24 VIN 3.3 VO 3 A, BW = 200 MHz
LMZ14203 30107051.gif
Figure 22. Thermal Derating VOUT = 3.3 V
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