ZHCS809E June   2013  – February 2020 LMZ31707

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化应用
  4. 4 修订历史记录
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Package Specifications
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
  6. 6 Device Information
    1. 6.1 Functional Block Diagram
    2.     Pin Functions
  7. 7 Typical Characteristics (PVIN = VIN = 12 V)
  8. 8 Typical Characteristics (PVIN = VIN = 5 V)
  9. 9 Typical Characteristics (PVIN = 3.3 V, VIN = 5 V)
  10. 10Application Information
    1. 10.1  Adjusting the Output Voltage
    2. 10.2  Capacitor Recommendations for the LMZ31707 Power Supply
      1. 10.2.1 Capacitor Technologies
        1. 10.2.1.1 Electrolytic, Polymer-Electrolytic Capacitors
        2. 10.2.1.2 Ceramic Capacitors
        3. 10.2.1.3 Tantalum, Polymer-Tantalum Capacitors
      2. 10.2.2 Input Capacitor
      3. 10.2.3 Output Capacitor
    3. 10.3  Transient Response
    4. 10.4  Transient Waveforms
    5. 10.5  Application Schematics
    6. 10.6  Custom Design With WEBENCH® Tools
    7. 10.7  VIN and PVIN Input Voltage
    8. 10.8  3.3 V PVIN Operation
    9. 10.9  Power Good (PWRGD)
    10. 10.10 SYNC_OUT
    11. 10.11 Parallel Operation
    12. 10.12 Light Load Efficiency (LLE)
    13. 10.13 Power-Up Characteristics
    14. 10.14 Pre-Biased Start-up
    15. 10.15 Remote Sense
    16. 10.16 Thermal Shutdown
    17. 10.17 Output On/Off Inhibit (INH)
    18. 10.18 Slow Start (SS/TR)
    19. 10.19 Overcurrent Protection
    20. 10.20 Synchronization (CLK)
    21. 10.21 Sequencing (SS/TR)
    22. 10.22 Programmable Undervoltage Lockout (UVLO)
    23. 10.23 Layout Considerations
    24. 10.24 EMI
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息
    1. 12.1 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.5 Thermal Information

THERMAL METRIC(1) LMZ31707 UNIT
RVQ42
42 PINS
θJA Junction-to-ambient thermal resistance(2) 13.3 °C/W
ψJT Junction-to-top characterization parameter(3) 1.6 °C/W
ψJB Junction-to-board characterization parameter(4) 5.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The junction-to-ambient thermal resistance, θJA, applies to devices soldered directly to a 100 mm × 100 mm double-sided PCB with 2-oz. copper and natural convection cooling. Additional airflow reduces θJA.
(3) The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device.
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