ZHCSHL8D December 2017 – August 2020 LMZM33602
PRODUCTION DATA
- 1特性
- 2应用
- 3说明
- 4Revision History
- 5Pin Configuration and Functions
- 6Specifications
-
7Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Adjusting the Output Voltage
- 7.3.2 Feedforward Capacitor, CFF
- 7.3.3 Voltage Dropout
- 7.3.4 Switching Frequency (RT)
- 7.3.5 Synchronization (SYNC)
- 7.3.6 Input Capacitors
- 7.3.7 Output Capacitors
- 7.3.8 Output On/Off Enable (EN)
- 7.3.9 Programmable Undervoltage Lockout (UVLO)
- 7.3.10 Power Good (PGOOD)
- 7.3.11 Overcurrent Protection (OCP)
- 7.3.12 Thermal Shutdown
- 7.4 Device Functional Modes
- 8Application and Implementation
- 9Device and Documentation Support
9.6 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |