6.1 Absolute Maximum Ratings
Over operating ambient temperature range (unless otherwise noted)(1)
|
MIN |
MAX |
UNIT |
| Input voltage |
VIN to PGND |
-0.3 |
42 |
V |
| EN to AGND |
-0.3 |
VIN + 0.3 |
V |
| FB, RT, SS/TRK to AGND |
-0.3 |
5 |
V |
| PGOOD to AGND |
-0.1 |
20 |
V |
| SYNC/MODE to AGND |
-0.3 |
5.5 |
V |
| BIAS_SEL to AGND |
-0.3 |
Lower of (VIN+0.3) and 20 |
V |
| AGND to PGND |
-0.3 |
0.3 |
V |
| Output voltage |
VOUT to PGND |
-0.3 |
VIN |
V |
| SW to PGND |
-0.3 |
VIN + 0.3 |
V |
| SW to PGND (<10 ns transients) |
-3.5 |
42 |
V |
| VCC to PGND |
-0.3 |
5 |
V |
| Temperature |
Maximum junction temperature, TJ(2) |
-40 |
125 |
°C |
| Storage temperature, Tstg |
-55 |
150 |
°C |
| Peak Reflow Case Temperature |
|
240 |
°C |
| Maximum Number of Reflows Allowed |
|
1 |
|
| Mechanical shock |
Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted |
|
500 |
G |
| Mechanical vibration |
Mil-STD-883D, Method 2007.2, 20 to 2000 Hz |
|
20 |
G |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under the recommended operating conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the module is never exceeded.