SLVS582J
April 2006 – August 2024
LP2950
,
LP2951
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics (Both Legacy and New Chip)
5.6
Timing Requirements
5.7
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagrams
6.3
Feature Description
6.3.1
Output Enable
6.3.2
Dropout Voltage
6.3.3
Current Limit
6.3.4
Undervoltage Lockout (UVLO)
6.3.5
Thermal Shutdown
6.4
Device Functional Modes
6.4.1
Shutdown Mode
7
Application and Implementation
7.1
Application Information
7.1.1
Reverse Current
7.1.2
Input and Output Capacitor Requirements
7.1.3
Estimating Junction Temperature
7.1.4
Power Dissipation (PD)
7.2
Typical Application
7.2.1
Design Requirements
7.2.1.1
Recommended Capacitor Types
7.2.1.1.1
Recommended Capacitors for the Legacy Chip
7.2.1.1.2
Recommended Capacitors for the New Chip
7.2.2
Detailed Design Procedure
7.2.2.1
Feedback Resistor Selection
7.2.2.2
Feedforward Capacitor
7.2.3
Application Curve
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Device Support
8.1.1
Development Support
8.2
Receiving Notification of Documentation Updates
8.3
Device Nomenclature
8.4
Documentation Support
8.4.1
Related Documentation
8.5
Support Resources
8.6
Trademarks
8.7
Electrostatic Discharge Caution
8.8
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
D|8
MSOI002K
DRG|8
MPDS151B
散热焊盘机械数据 (封装 | 引脚)
DRG|8
QFND084H
订购信息
slvs582j_oa
slvs582j_pm
6.2
Functional Block Diagrams
Figure 6-1
LP2951 Functional Block Diagram
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