ZHCSSD8F april   2000  – july 2023 LP2980-ADJ

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Current Limit
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Output Pulldown
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 External Feedback Resistors
      2. 8.1.2 Recommended Capacitor Types
        1. 8.1.2.1 Recommended Capacitors for the New Chip
        2. 8.1.2.2 Recommended Capacitors for the Legacy Chip
      3. 8.1.3 Input and Output Capacitor Requirements
      4. 8.1.4 Feed-Forward Capacitor (CFF)
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting VOUT For the LP2980-ADJ LDO
        2. 8.2.2.2 ON/OFF Input Operation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.2.3 Application Curves

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 1.0 V or 2.5 V (whichever is greater), IOUT = 1 mA, ON/OFF pin tied to VIN, CIN = 1.0 µF, and COUT = 4.7 µF (unless otherwise noted)

GUID-C5D1C0B6-F4EC-49F3-9101-9B2594ACD365-low.png
 
Figure 8-3 Load Transient Response for Legacy Chip
GUID-557C3FFD-54CC-4442-85C6-143D6BA320A4-low.png
 
Figure 8-5 Line Transient Response for Legacy Chip
GUID-20230619-SS0I-LRCV-BQDV-JWXXPN5ZTNZD-low.svg
VOUT = 3.3 V, dV/dt = 1 V/μs
Figure 8-7 Start-Up vs CFF for New Chip
GUID-20230619-SS0I-HZJW-BRNS-1G5RTVF7QTSM-low.svg
dI/dt = 1 A/μF
Figure 8-4 Load Transient Response for New Chip
GUID-20230619-SS0I-2PNJ-LPS4-ZRPNTCZZSLMB-low.svg
VOUT = 3.3 V, ΔVIN = 1 V, IOUT = 50 mA, dV/dt = 1 V/μs
Figure 8-6 Line Transient Response for New Chip
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