米6体育平台手机版

ZHCSSD8F april 2000 – july 2023 LP2980-ADJ

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

DBV|5
- MPDS018T

散热焊盘机械数据 (封装 | 引脚)

订购信息

6.4 Thermal Information

THERMAL METRIC ⁽²⁾ ⁽¹⁾		Legacy Chip	New Chip	UNIT
		DBV (SOT23-5)	DBV (SOT23-5)
		5 PINS	5 PINS
R_θJA	Junction-to-ambient thermal resistance	205.4	178.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	78.8	77.9	°C/W
R_θJB	Junction-to-board thermal resistance	46.7	47.2	°C/W
ψ_JT	Junction-to-top characterization parameter	8.3	15.9	°C/W
ψ_JB	Junction-to-board characterization parameter	46.3	46.9	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.

(2) Thermal performance results are based on the JEDEC standard of 2s2p PCB configuration. These thermal metric parameters can be further improved by 35-55% based on thermally optimized PCB layout designs. See the analysis of the Impact of board layout on LDO thermal performance application report.