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ZHCSS00AA march 2000 – july 2023 LP2985-N

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

DBV|5
- MPDS018T

散热焊盘机械数据 (封装 | 引脚)

订购信息

9.2 Device Nomenclature

Table 9-1 Available Options⁽¹⁾

PRODUCT	V_OUT
LP2985cxxxz-y.y/NOPB Legacy chip	xxx is the package designator.z is the package quantity. X is for large quantity reel and non-X is for small quantity reel. y.y is the nominal output voltage (for example, 3.3 = 3.3 V; 5.0 = 5.0 V).c is the accuracy specification, A for higher accuracy and non-A for standard grade.
LP2985Axxxz-y.y/M3 New chip	xxx is the package designator.z is the package quantity. X is for large quantity reel and non-X is for small quantity reel y.y is the nominal output voltage (for example, 3.3 = 3.3 V; 5.0 = 5.0 V). M3 is a suffix designator for newer chip redesigns, fabricated on the latest TI process technology.

PRODUCT

V_OUT

LP2985cxxxz-y.y/NOPB

Legacy chip

xxx is the package designator.z is the package quantity. X is for large quantity reel and non-X is for small quantity reel.
y.y is the nominal output voltage (for example, 3.3 = 3.3 V; 5.0 = 5.0 V).c is the accuracy specification, A for higher accuracy and non-A for standard grade.

LP2985Axxxz-y.y/M3

New chip

xxx is the package designator.z is the package quantity. X is for large quantity reel and non-X is for small quantity reel
y.y is the nominal output voltage (for example, 3.3 = 3.3 V; 5.0 = 5.0 V).
M3 is a suffix designator for newer chip redesigns, fabricated on the latest TI process technology.

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com.