ZHCSLK4R july   2004  – july 2023 LP2985 , LP2985A

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Current Limit
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Output Pulldown
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Noise Bypass Capacitor (CBYPASS)
      4. 8.1.4 Reverse Current
      5. 8.1.5 Power Dissipation (PD)
      6. 8.1.6 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ON/OFF Operation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

Revision History

Changes from Revision Q (December 2022) to Revision R (July 2023)

  • Widening IGND spec limits to accommodate complete VOUT rangeGo

Changes from Revision P (February 2022) to Revision Q (December 2022)

  • 更改了特性 部分Go
  • 应用 部分添加了最后一个要点Go
  • 更改了说明 部分Go
  • Changed Description column and added footnote to Pin Functions table Go
  • Changed condition statement and curve titles and added curves for new chip in Typical Characteristics sectionGo
  • Changed Overview sectionGo
  • Changed Functional Block Diagram figureGo
  • Changed Feature Description section and added subsectionsGo
  • Added Output Pulldown sectionGo
  • Changed Device Functional Modes section: changed Normal Operation section, added Device Functional Mode Comparison, Dropout Operation, and Disabled sections, and deleted Shutdown Mode sectionGo
  • Changed Application Information section: deleted previous information and added new subsectionsGo
  • Added Recommended Capacitor Types sectionGo
  • Added Input and Output Capacitor Requirements sectionGo
  • Added start-up behavior discussion to Noise Bypass Capacitor (CBYPASS) sectionGo
  • Added Reverse Current sectionGo
  • Added Power Dissipation (PD) sectionGo
  • Added Estimating Junction Temperature sectionGo
  • Changed LOW and HIGH pin voltages and deleted slew rate discussion from ON/OFF Operation sectionGo
  • Changed Application Curves sectionGo
  • Changed Layout Diagram figureGo
  • Added Device Nomenclature sectionGo