米6体育平台手机版

SNVS185F February 2002 – April 2017 LP3982

PRODUCTION DATA.

封装选项

机械数据 (封装 | 引脚)

DGK|8
- MPDS028E
NGM|8
- MPDS400

散热焊盘机械数据 (封装 | 引脚)

订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾⁽³⁾

	MIN	MAX	UNIT
V_IN, V_OUT, V_SHDN, V_SET, V_CC, V_FAULT	−0.3	6.5	V
Fault sink current		20	mA
Power dissipation	See⁽⁴⁾
Junction temperature, T_J		150	°C
Storage temperature, T_stg	–65	160	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to the potential at the GND pin.

(3) If Military/Aerospace-specified devices are required, contact Texas Instruments Sales Office/Distributors for availability and specifications.

(4) In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (T_A(MAX)) is dependant on the maximum operating junction temperature (T_J(MAX-OP)), the maximum power dissipation (P_D(MAX)), and the junction-to-ambient thermal resistance in the application (R_θJA). This relationship is given by: T_A(MAX) = T_J(MAX-OP) − (P_D(MAX) × R_θJA).The value of the R_θJA for the WSON package is specifically dependent on the PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to TI Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401).

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Machine model	±200	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions⁽¹⁾⁽²⁾

	MIN	NOM	MAX	UNIT
Operating temperature	–40		85	°C
Supply voltage	2.5		6	V

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LP3982		UNIT
		DGK (VSSOP)	NGM (WSON)⁽²⁾
		8 PINS	8 PINS
R_θJA⁽³⁾	Junction-to-ambient thermal resistance, High-K	175.2	52.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	66.0	66.2	°C/W
R_θJB	Junction-to-board thermal resistance	95.6	16.7	°C/W
ψ_JT	Junction-to-top characterization parameter	9.7	1.9	°C/W
ψ_JB	Junction-to-board characterization parameter	94.2	16.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	11.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) The PCB for the WSON/NGN package R_θJA includes thermal vias under the exposed thermal pad per EIA/JEDEC JESD51-5.

(3) Thermal resistance value R_θJA is based on the EIA/JEDEC High-K printed circuit board defined by: JESD51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.

6.5 Electrical Characteristics

Unless otherwise specified, all limits are specified for V_IN = V_OUT + 0.5 V⁽¹⁾, V_SHDN = V_IN, C_IN = C_OUT = 2.2 μF, C_CC = 33 nF, T_J = 25°C.

PARAMETER		TEST CONDITIONS	MIN⁽²⁾	TYP⁽³⁾	MAX⁽²⁾	UNIT
V_IN	Input voltage	For operating temperature extremes: −40°C to 85°C	2.5		6	V
ΔV_OUT	Output voltage tolerance	100 μA ≤ I_OUT ≤ 300 mA V_IN = V_OUT + 0.5 V⁽¹⁾ SET = OUT for the ADJ Versions	−2		2	% of V_{OUT (NOM)}
ΔV_OUT	Output voltage tolerance	For operating temperature extremes: −40°C to 85°C	−3		3	% of V_{OUT (NOM)}
V_OUT	Output adjust range	ADJ version only; for operating temperature extremes: −40°C to 85°C	1.25		6	V
I_OUT	Maximum output current	Average DC current rating; For operating temperature extremes: −40°C and 85°C	300			mA
I_LIMIT	Output current limit			770		mA
I_LIMIT	Output current limit	For operating temperature extremes: −40°C to 85°C	330			mA
I_Q	Supply current	I_OUT = 0 mA		90		μA
		I_OUT = 0 mA; for operating temperature extremes: −40°C to 85°C			270
		I_OUT = 300 mA		225
	Shutdown supply current	V_O = 0 V, SHDN = GND		0.001	1	μA
V_DO	Dropout voltage⁽¹⁾⁽⁴⁾	I_OUT = 1 mA		0.4		mV
		I_OUT = 200 mA		80
		I_OUT = 200 mA; for operating temperature extremes: −40°C to 85°C			220
		I_OUT = 300 mA		120
ΔV_OUT	Line regulation	I_OUT = 1 mA, (V_OUT + 0.5 V) ≤ V_I ≤ 6 V⁽¹⁾		0.01		%/V
	Line regulation	I_OUT = 1 mA, (V_OUT + 0.5 V) ≤ V_I ≤ 6 V⁽¹⁾; for operating temperature extremes: −40°C to 85°C	−0.1		0.1	%/V
	Load regulation	100 μA ≤ I_OUT ≤ 300 mA		0.002		%/mA
e_n	Output voltage noise	I_OUT = 10 mA, 10 Hz ≤ f ≤ 100 kHz		37		μV_RMS
e_n	Output voltage noise density	10 Hz ≤ f ≤ 100 kHz, C_OUT = 10 μF		190		nV/√Hz
V_SHDN	SHDN input threshold	V_IH, (V_OUT + 0.5 V) ≤ V_IN ≤ 6 V⁽¹⁾; for operating temperature extremes: −40°C to 85°C	2			V
V_SHDN	SHDN input threshold	V_IL, (V_OUT + 0.5 V) ≤ V_IN ≤ 6 V⁽¹⁾; for operating temperature extremes:−40°C to 85°C			0.4	V
I_SHDN	SHDN input bias current	SHDN = GND or IN		0.1	100	nA
I_SET	SET input leakage	SET = 1.3 V, ADJ version only⁽⁵⁾		0.1	2.5	nA
V_FAULT	FAULT detection voltage	V_O ≥ 2.5 V, I_OUT = 200 mA⁽⁶⁾		120		mV
	FAULT detection voltage	V_OUT ≥ 2.5 V, I_OUT = 200 mA⁽⁶⁾; for operating temperature extremes: −40°C to 85°C			280	mV
	FAULT output low voltage	I_SINK = 2 mA		0.115		V
	FAULT output low voltage	I_SINK = 2 mA; for operating temperature extremes: −40°C to 85°C			0.25	V
I_FAULT	FAULT off-leakage current	FAULT = 3.6 V, SHDN = 0 V		0.1	100	nA
T_SD	Thermal shutdown temperature			160		°C
T_SD	Thermal shutdown hysteresis			10		°C
T_ON	Start-up time	C_OUT = 10 μF, V_OUT at 90% of final value		120		μs

(1) Condition does not apply to input voltages below 2.5 V because this is the minimum input operating voltage.

(2) All limits are verified by testing or statistical analysis.

(3) Typical values represent the most likely parametric norm.

(4) Dropout voltage is measured by reducing V_IN until V_OUT drops 100 mV from its nominal value at V_IN – V_OUT = 0.5 V. Dropout voltage does not apply to the 1.8-V version.

(5) The SET pin is not externally connected for the fixed versions.

(6) The FAULT detection voltage is specified for the input-to-output voltage differential at which the FAULT pin goes active low.