SNVS161E October   2001  – October 2015 LP3988

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable (EN)
      2. 8.3.2 Regulated Output (OUT)
      3. 8.3.3 Power Good (PG) Output
      4. 8.3.4 PG Delay Time
      5. 8.3.5 Current Limit
      6. 8.3.6 Thermal Shutdown (TSD)
      7. 8.3.7 Fast Turnon Time
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation
      2. 8.4.2 Dropout Operation
      3. 8.4.3 Disabled
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 External Capacitors
        2. 9.2.2.2 Input Capacitor
        3. 9.2.2.3 Output Capacitors
        4. 9.2.2.4 No-Load Stability
        5. 9.2.2.5 Capacitor Characteristics
        6. 9.2.2.6 Power Dissipation
        7. 9.2.2.7 Estimating Junction Temperature
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
    3. 11.3 DSBGA Mounting
  12. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from D Revision (May 2013) to E Revision

  • Changed "−40°C to +80°C" to "−40°C to +125°C" under FeaturesGo
  • Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Updated Thermal Information Go

Changes from C Revision (May 2013) to D Revision

  • Changed layout of National Data Sheet to TI formatGo
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