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SNVS296J December 2006 – June 2016 LP3991

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机械数据 (封装 | 引脚)

YZR|4
- MXBG267

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾⁽³⁾

	MIN	MAX	UNIT
IN, OUT pins, voltage to GND	–0.3	6.5	V
EN pin, voltage to GND	–0.3	(V_IN + 0.3) < 6.5	V
Junction temperature		150	°C
Continuous power dissipation⁽⁴⁾	Internally Limited
Storage temperature, T_stg	–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to the potential at the GND pin.

(3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

(4) Internal thermal shutdown circuitry protects the device from permanent damage.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±200	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

	MIN	MAX	UNIT
Input voltage	1.65	4	V
Recommended load current		300	mA
Junction temperature	–40	125	°C
Ambient temperature, T_A⁽¹⁾	–40	85	°C

(1) The maximum ambient temperature (T_A-MAX) is a suggested value dependant on the maximum operating junction temperature (T_J-MAX-OP) = 125°C); the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to-ambient thermal resistance of the part / package in the application (R_θJA), as given by the following equation: T_A-MAX = T_J-MAX-OP – (R_θJA × P_D-MAX).

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LP3991	UNIT
		YZR (DSBGA)
		4 PINS
R_θJA⁽²⁾	Junction-to-ambient thermal resistance, High K	189.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	0.5	°C/W
R_θJB	Junction-to-board thermal resistance	112.9	°C/W
ψ_JT	Junction-to-top characterization parameter	8.7	°C/W
ψ_JB	Junction-to-board characterization parameter	112.8	°C/W

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2) Thermal resistance value R_θJA is based on the EIA/JEDEC High-K printed circuit board defined by: JESD51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.

6.5 Electrical Characteristics

Unless otherwise noted, V_EN = 950 mV, V_IN = V_OUT + 0.5 V, or 1.8 V, whichever is higher, C_IN = 1 µF, C_OUT = 4.7 µF, I_OUT = 1 mA. Typical values and limits apply for T_A = 25°C. Minimum and maximum limits apply over the full junction temperature range for operation, −40°C to +125°C, unless otherwise specified. ⁽¹⁾

PARAMETER		TEST CONDITIONS		MIN	TYP	MAX	UNIT
V_IN	Input voltage	See⁽²⁾		1.65		3.6	V
V_IN	Input voltage	See⁽³⁾⁽⁴⁾⁽⁵⁾				4	V
ΔV_OUT	Output voltage tolerance	V_IN = V_IN(NOM) to 3.6 V I_LOAD = 1 to 300 mA	T_J = 25°C		–1%	1%
					–3%	3%
			T_J = –25°C to 85°C		–2.5%	2.5%
	Line regulation error	V_IN = V_OUT(NOM) 0.5 V to 3.6 V, I_OUT = 1 mA, 0.8 V ≤ V_OUT ≤ 2.8 V			0.05	1	%/V
	Load regulation error	I_OUT = 1 mA to 300 mA			10	60	µV/mA
V_DO	Dropout voltage⁽⁶⁾	1.8 V ≤ V_OUT ≤ 2.5 V	I_OUT = 150 mA		55	90	mV
		1.8 V ≤ V_OUT ≤ 2.5 V	I_OUT = 300 mA		110	180
		V_OUT > 2.5 V	I_OUT = 150 mA		40	80
		V_OUT > 2.5 V	I_OUT = 300 mA		75	160
I_LOAD	Minimum load current	See⁽⁷⁾		0			mA
I_Q	Quiescent current	V_EN = 950 mV, I_OUT = 0 mA			50	100	µA
		V_EN = 950 mV, I_OUT = 300 mA			120	225
		V_EN = 0.4 V			0.001	1
I_SC	Short-circuit current limit	V_IN = 3.6 V⁽⁸⁾			550	900	mA
I_OUT	Maximum output current			300			mA
PSRR	Power Supply Rejection Ratio⁽⁹⁾	ƒ = 1kHz, I_OUT = 1 mA to 300 mA			65		dB
e_n	Output noise voltage⁽⁹⁾	BW = 10 Hz to 100 kHz, V_IN = 4.2 V, C_OUT = 4.7 µF			280		µV_RMS
T_SHUTDOWN	Thermal shutdown	Temperature			160		°C
T_SHUTDOWN	Thermal shutdown	Hysteresis			20		°C
ENABLE CONTROL CHARACTERISTICS
I_EN⁽¹⁰⁾	Maximum input current at V_EN input	V_EN = 0 V, V_IN = 3.6 V			0.001		µA
I_EN⁽¹⁰⁾	Maximum input current at V_EN input	V_EN = V_IN = 3.6 V			3	5.5	µA
V_IL	Low input threshold	V_IN = 1.65 V to 3.6 V				0.4	V
V_IH	High input threshold	V_IN = 1.65 V to 3.6 V		0.95			V
TIMING CHARACTERISTICS
Transient Response	Line transient response \|δV_OUT\|	T_rise = T_fall = 30 µs⁽⁹⁾ δV_IN = 600 mV			6		mV (pk - pk)
	Load transient response \|δV_OUT\|	T_rise = T_fall = 1 µs⁽⁹⁾	I_OUT = 0 mA to 300 mA		140		mV
			I_OUT = 1 mA to 300 mA		110
			I_OUT = 300 mA to 1 mA		80
			I_OUT = 0 mA to 200 mA		110
			I_OUT = 1 mA to 200 mA		80
			I_OUT = 200 mA to 1 mA		60
			I_OUT = 0 mA to 150 mA		100
			I_OUT = 1 mA to 150 mA		70
			I_OUT = 150 mA to 1 mA		50
	Overshoot on start-up				0%	2%
I_IR	In-rush current⁽⁹⁾				600	1000	mA
OUTPUT CAPACITANCE
C_OUT	Output capacitor	Capacitance⁽¹¹⁾	V_OUT ≥ 1.5 V	2	4.7		µF
		Capacitance⁽¹¹⁾	V_OUT < 1.5 V⁽¹²⁾	1.6	2.2		µF
		ESR		5		500	mΩ

(1) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production at T_J = 25°C or correlated using Statistical Quality Control methods. Operation over the temperature specification is ensured by correlating the electrical characteristics to process and temperature variations and applying statistical process control.

(2) All voltages are with respect to the potential at the GND pin.

(3) V_IN(MIN) = V_OUT(NOM) + 0.5 V or 1.65 V, whichever is greater. (See Figure 19 in DSBGA Light Sensitivity.)

(4) The device operates with input voltages up to 4 V. However special care must be taken in relation to thermal dissipation and the need to derate the maximum allowable ambient temperature.

(5) The maximum ambient temperature (T_A-MAX) is a suggested value dependant on the maximum operating junction temperature (T_J-MAX-OP) = 125°C); the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to-ambient thermal resistance of the part / package in the application (R_θJA), as given by the following equation: T_A-MAX = T_J-MAX-OP – (R_θJA × P_D-MAX).

(6) Dropout voltage is voltage difference between input and output at which the output voltage drops to 100 mV below its nominal value. This parameter is only specified for output voltages above 1.8 V.

(7) The device maintains the regulated output voltage without a load.

(8) Short circuit current is measured with V_OUT pulled to 0 V.

(9) This electrical specification is ensured by design.

(10) EN pin has an internal 1.2-MΩ (typical) resistor connected to GND.

(11) The capacitor tolerance must be 30% or better over temperature. The full operating conditions for the application must be considered when selecting a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is X7R or X5R. (See External Capacitors in Detailed Design Procedure.)

(12) On lower voltage options, 2.2-µF output capacitor may be used but some degradation in load transient (10 -15%) can be expected, compared to a 4.7-µF capacitor.

6.6 Timing Requirements

		MIN	NOM	MAX	UNIT
t_ON	Turnon time⁽¹⁾ To 95% Level V_IN(MIN) to 3.6 V, V_OUT ≤ 2 V		100		µs
t_ON	Turnon time⁽¹⁾ To 95% Level V_IN(MIN) to 3.6 V, V_OUT ≥ 2 V		140		µs

(1) This electrical specification is ensured by design.

6.7 Typical Characteristics

Unless otherwise specified, C_IN = 1 µF ceramic, C_OUT = 4.7 µF ceramic, V_IN = V_OUT(NOM) + 0.5 V or 1.8 V, whichever is greater, T_A = 25°C, V_OUT(NOM) = 1.5 V, EN pin is tied to V_IN.