ZHCSJT3B May 2019 – August 2020 LP5009 , LP5012
PRODUCTION DATA
| PIN | I/O | DESCRIPTION | ||||
|---|---|---|---|---|---|---|
| NAME | RUK NO. |
PW NO. | ||||
| LP5009 | LP5012 | LP5009 | LP5012 | |||
| ADDR0 | 14 | 14 |
1 |
1 | — | I2C slave-address selection pin. This pin must not be left floating. |
| ADDR1 | 15 | 15 |
3 |
3 | — | I2C slave-address selection pin. This pin must not be left floating. |
| EN | 19 | 19 |
8 |
8 | I | Chip enable input pin. |
| IREF | 20 | 20 |
9 |
9 | — | Output current-reference global-setting pin. |
| NC | 11, 12, 13 | — |
22, 23, 24 | — | — | No internal connection. |
| OUT0 | 2 | 2 |
12 |
12 | O | Current sink output 0. If not used, this pin can be left floating. |
| OUT1 | 3 | 3 |
13 |
13 | O | Current sink output 1. If not used, this pin can be left floating. |
| OUT2 | 4 | 4 |
14 |
14 | O | Current sink output 2. If not used, this pin can be left floating. |
| OUT3 | 5 | 5 |
15 |
15 | O | Current sink output 3. If not used, this pin can be left floating. |
| OUT4 | 6 | 6 |
16 |
16 | O | Current sink output 4. If not used, this pin can be left floating. |
| OUT5 | 7 | 7 |
17 |
17 | O | Current sink output 5. If not used, this pin can be left floating. |
| OUT6 | 8 | 8 |
19 |
19 | O | Current sink output 6. If not used, this pin can be left floating. |
| OUT7 | 9 | 9 |
20 |
20 | O | Current sink output 7. If not used, this pin can be left floating. |
| OUT8 | 10 | 10 |
21 |
21 | O | Current sink output 8. If not used, this pin can be left floating. |
| OUT9 | — | 11 |
— |
22 | O | Current sink output 9. If not used, this pin can be left floating. |
| OUT10 | — | 12 | — |
23 | O | Current sink output 10. If not used, this pin can be left floating. |
| OUT11 | — | 13 | — |
24 | O | Current sink output 11. If not used, this pin can be left floating. |
| SCL | 18 | 18 |
7 |
7 | I | I2C bus clock line. If not used, this pin must be connected to GND or VCC. |
| SDA | 17 | 17 |
5 |
5 | I/O | I2C bus data line. If not used, this pin must be connected to GND or VCC. |
| VCAP | 1 | 1 |
10 |
10 | — | Internal LDO output pin, this pin must be connected to a 1-µF capacitor to GND. Place the capacitor as close to the device as possible. |
| VCC | 16 | 16 |
4 |
4 | — | Power supply. |
| GND | Thermal pad | Thermal pad |
— | — | — | Exposed thermal pad also serves the ground pin for the WQFN package. |
|
AGND |
— | — |
2 |
2 | — |
Analog circuits ground. AGND, PGND and DGND must be conntected together. |
|
PGND | — | — |
6 |
6 | — |
Power ground. AGND, PGND and DGND must be conntected together. |
|
DGND | — | — |
18 |
18 | — |
Digital circuits ground. AGND, PGND and DGND must be conntected together. |