ZHCSJT3B May   2019  – August 2020 LP5009 , LP5012

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 PWM Control for Each Channel
        1. 8.3.1.1 Independent Color Mixing Per RGB LED Module
        2. 8.3.1.2 Independent Intensity Control Per RGB LED Module
          1. 8.3.1.2.1 Intensity-Control Register Configuration
          2. 8.3.1.2.2 Logarithmic- or Linear-Scale Intensity Control
        3. 8.3.1.3 12-Bit, 29-kHz PWM Generator Per Channel
          1. 8.3.1.3.1 PWM Generator
        4. 8.3.1.4 PWM Phase-Shifting
      2. 8.3.2 LED Bank Control
      3. 8.3.3 Current Range Setting
      4. 8.3.4 Automatic Power-Save Mode
      5. 8.3.5 Protection Features
        1. 8.3.5.1 Thermal Shutdown
        2. 8.3.5.2 UVLO
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
        1. 8.5.1.1 Data Validity
        2. 8.5.1.2 Start and Stop Conditions
        3. 8.5.1.3 Transferring Data
        4. 8.5.1.4 I2C Slave Addressing
        5. 8.5.1.5 Control-Register Write Cycle
        6. 8.5.1.6 Control-Register Read Cycle
        7. 8.5.1.7 Auto-Increment Feature
    6. 8.6 Register Maps
      1.      45
      2. 8.6.1  DEVICE_CONFIG0 (Address = 0h) [reset = 0h]
      3. 8.6.2  DEVICE_CONFIG1 (Address = 1h) [reset = 3Ch]
      4. 8.6.3  LED_CONFIG0 (Address = 2h) [reset = 00h]
      5. 8.6.4  BANK_BRIGHTNESS (Address = 3h) [reset = FFh]
      6. 8.6.5  BANK_A_COLOR (Address = 4h) [reset = 00h]
      7. 8.6.6  BANK_B_COLOR (Address = 5h) [reset = 00h]
      8. 8.6.7  BANK_C_COLOR (Address = 6h) [reset = 00h]
      9. 8.6.8  LED0_BRIGHTNESS (Address = 7h) [reset = FFh]
      10. 8.6.9  LED1_BRIGHTNESS (Address = 8h) [reset = FFh]
      11. 8.6.10 LED2_BRIGHTNESS (Address = 9h) [reset = FFh]
      12. 8.6.11 LED3_BRIGHTNESS (Address = 0Ah) [reset = FFh]
      13. 8.6.12 OUT0_COLOR (Address = 0Bh) [reset = 00h]
      14. 8.6.13 OUT1_COLOR (Address = 0Ch) [reset = 00h]
      15. 8.6.14 OUT2_COLOR (Address = 0Dh) [reset = 00h]
      16. 8.6.15 OUT3_COLOR (Address = 0Eh) [reset = 00h]
      17. 8.6.16 OUT4_COLOR (Address = 0Fh) [reset = 00h]
      18. 8.6.17 OUT5_COLOR (Address = 10h) [reset = 00h]
      19. 8.6.18 OUT6_COLOR (Address = 11h) [reset = 00h]
      20. 8.6.19 OUT7_COLOR (Address = 12h) [reset = 00h]
      21. 8.6.20 OUT8_COLOR (Address = 13h) [reset = 00h]
      22. 8.6.21 OUT9_COLOR (Address = 14h) [reset = 00h]
      23. 8.6.22 OUT10_COLOR (Address = 15h) [reset = 00h]
      24. 8.6.23 OUT11_COLOR (Address = 16h) [reset = 00h]
      25. 8.6.24 RESET (Address = 17h) [reset = 00h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) LP5009 or LP5012 UNIT
RUK (QFN)

PW (TSSOP)
20 PINS

24 Pins
RθJA Junction-to-ambient thermal resistance 53.7

98.3

 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 55.3

41.5

 °C/W
RθJB Junction-to-board thermal resistance 27.4

53.5

 °C/W
ψJT Junction-to-top characterization parameter 1.9

5.0

 °C/W
ψJB Junction-to-board characterization parameter 27.4

53.1

 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 12.9

n/a

 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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