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ZHCSOR4 December 2021 LP5862

PRODUCTION DATA

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		LP5864, LP5862, LP5861	UNIT
		RSM (VQFN)
		32 PINS
R_θJA	Junction-to-ambient thermal resistance	32.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	29.2	°C/W
R_θJB	Junction-to-board thermal resistance	12.3	°C/W
Ψ_JT	Junction-to-top characterization parameter	0.4	°C/W
Ψ_JB	Junction-to-board characterization parameter	12.3	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	3.7	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.