Place the decoupling capacitor near the VCC/VR, VG/VB pins and GND plane.
Place the current programming resistor RIREF close to IREFpin and GND plane.
Route the GND thermal pad as widely as possible for large GND currents.
Maximum GND current is approximately 2 A for two
devices (96-CH × 20 mA = 1.92 A).
The Thermal pad must be connected to GND plane because the pad is used as
power ground pin internally. There is a large
current flow through this pad when all channels
turn on. Furthermore, this pad should be connected
to a heat sink layer by thermal via to reduce
device temperature. For more information about
suggested thermal via pattern and via size, see
the PowerPAD™ Thermally Enhanced
Package Application Report.
Routing between the LED Anode side and the device OUTXn pin should be as short and straight as possible to reduce wire inductance.
The line switch pins should be located in the middle of the matrix, which should be laid out as symmetrically as possible.