ZHCSO29 July   2021 LP5890

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Independent and Stackable Mode
        1. 8.3.1.1 Independent Mode
        2. 8.3.1.2 Stackable Mode
      2. 8.3.2 Current Setting
        1. 8.3.2.1 Brightness Control (BC) Function
        2. 8.3.2.2 Color Brightness Control (CC) Function
        3. 8.3.2.3 Choosing BC/CC for a Different Application
      3. 8.3.3 Frequency Multiplier
      4. 8.3.4 Line Transitioning Sequence
      5. 8.3.5 Protections and Diagnostics
        1. 8.3.5.1 Thermal Shutdown Protection
        2. 8.3.5.2 IREF Resistor Short Protection
        3. 8.3.5.3 LED Open Load Detection and Removal
          1. 8.3.5.3.1 LED Open Detection
          2. 8.3.5.3.2 Read LED Open Information
          3. 8.3.5.3.3 LED Open Caterpillar Removal
        4. 8.3.5.4 LED Short and Weak Short Circuitry Detection and Removal
          1. 8.3.5.4.1 LED Short and Weak Short Detection
          2. 8.3.5.4.2 Read LED Short Information
          3. 8.3.5.4.3 LSD Caterpillar Removal
    4. 8.4 Device Functional Modes
    5. 8.5 Continuous Clock Series Interface
      1. 8.5.1 Data Validity
      2. 8.5.2 CCSI Frame Format
      3. 8.5.3 Write Command
        1. 8.5.3.1 Chip Index Write Command
        2. 8.5.3.2 VSYNC Write Command
        3. 8.5.3.3 Soft_Reset Command
        4. 8.5.3.4 Data Write Command
      4. 8.5.4 Read Command
    6. 8.6 PWM Grayscale Control
      1. 8.6.1 Grayscale Data Storage and Display
        1. 8.6.1.1 Memory Structure Overview
        2. 8.6.1.2 Details of Memory Bank
        3. 8.6.1.3 Write a Frame Data into Memory Bank
      2. 8.6.2 PWM Control for Display
    7. 8.7 Register Maps
      1. 8.7.1  FC0
      2. 8.7.2  FC1
      3. 8.7.3  FC2
      4. 8.7.4  FC3
      5. 8.7.5  FC4
      6. 8.7.6  FC10
      7. 8.7.7  FC11
      8. 8.7.8  FC12
      9. 8.7.9  FC13
      10. 8.7.10 FC14
      11. 8.7.11 FC15
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 System Structure
        2. 9.2.1.2 SCLK Frequency
        3. 9.2.1.3 Internal GCLK Frequency
        4. 9.2.1.4 Line Switch Time
        5. 9.2.1.5 Blank Time Removal
        6. 9.2.1.6 BC and CC
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Chip Index Command
        2. 9.2.2.2 FC Registers Settings
        3. 9.2.2.3 Grayscale Data Write
        4. 9.2.2.4 VSYNC Command
        5. 9.2.2.5 LED Open and Short Read
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

12.2 支持资源

TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅 TI 的《使用条款》。
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