ZHCSQX1A August   2022  – December 2022 LP5891-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Independent and Stackable Mode
        1. 8.3.1.1 Independent Mode
        2. 8.3.1.2 Stackable Mode
      2. 8.3.2 Current Setting
        1. 8.3.2.1 Brightness Control (BC) Function
        2. 8.3.2.2 Color Brightness Control (CC) Function
        3. 8.3.2.3 Choosing BC/CC for a Different Application
      3. 8.3.3 Frequency Multiplier
      4. 8.3.4 Line Transitioning Sequence
      5. 8.3.5 Protections and Diagnostics
        1. 8.3.5.1 Thermal Shutdown Protection
        2. 8.3.5.2 IREF Resistor Short Protection
        3. 8.3.5.3 LED Open Load Detection and Removal
          1. 8.3.5.3.1 LED Open Detection
          2. 8.3.5.3.2 Read LED Open Information
          3. 8.3.5.3.3 LED Open Caterpillar Removal
        4. 8.3.5.4 LED Short and Weak Short Circuitry Detection and Removal
          1. 8.3.5.4.1 LED Short/Weak Short Detection
          2. 8.3.5.4.2 Read LED Short Information
          3. 8.3.5.4.3 LSD Caterpillar Removal
    4. 8.4 Device Functional Modes
    5. 8.5 Continuous Clock Series Interface
      1. 8.5.1 Data Validity
      2. 8.5.2 CCSI Frame Format
      3. 8.5.3 Write Command
        1. 8.5.3.1 Chip Index Write Command
        2. 8.5.3.2 VSYNC Write Command
        3. 8.5.3.3 MPSM Write Command
        4. 8.5.3.4 Standby Clear and Enable Command
        5. 8.5.3.5 Soft_Reset Command
        6. 8.5.3.6 Data Write Command
      4. 8.5.4 Read Command
    6. 8.6 PWM Grayscale Control
      1. 8.6.1 Grayscale Data Storage and Display
        1. 8.6.1.1 Memory Structure Overview
        2. 8.6.1.2 Details of Memory Bank
        3. 8.6.1.3 Write a Frame Data into Memory Bank
      2. 8.6.2 PWM Control for Display
    7. 8.7 Register Maps
      1. 8.7.1  FC0
      2. 8.7.2  FC1
      3. 8.7.3  FC2
      4. 8.7.4  FC3
      5. 8.7.5  FC4
      6. 8.7.6  FC14
      7. 8.7.7  FC15
      8. 8.7.8  FC16
      9. 8.7.9  FC17
      10. 8.7.10 FC18
      11. 8.7.11 FC19
      12. 8.7.12 FC20
      13. 8.7.13 FC21
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 System Structure
        2. 9.2.1.2 SCLK Frequency
        3. 9.2.1.3 Internal GCLK Frequency
        4. 9.2.1.4 Line Switch Time
        5. 9.2.1.5 Blank Time Removal
        6. 9.2.1.6 BC and CC
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Chip Index Command
        2. 9.2.2.2 FC Registers Settings
        3. 9.2.2.3 Grayscale Data Write
        4. 9.2.2.4 VSYNC Command
        5. 9.2.2.5 LED Open, Short Read
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RRF|76
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) LP5891-Q1 UNIT
RRF (VQFN)
76 PINS
RθJA Junction-to-ambient thermal resistance 22.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 10.7 °C/W
RθJB Junction-to-board thermal resistance 7.2 °C/W
ψJT Junction-to-top characterization parameter 0.1 °C/W
ψJB Junction-to-board characterization parameter 7.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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