ZHCSQG6A March   2022  – May 2022 LP5891

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Independent and Stackable Mode
        1. 7.3.1.1 Independent Mode
        2. 7.3.1.2 Stackable Mode
      2. 7.3.2 Current Setting
        1. 7.3.2.1 Brightness Control (BC) Function
        2. 7.3.2.2 Color Brightness Control (CC) Function
        3. 7.3.2.3 Choosing BC/CC for a Different Application
      3. 7.3.3 Frequency Multiplier
      4. 7.3.4 Line Transitioning Sequence
      5. 7.3.5 Protections and Diagnostics
        1. 7.3.5.1 Thermal Shutdown Protection
        2. 7.3.5.2 IREF Resistor Short Protection
        3. 7.3.5.3 LED Open Load Detection and Removal
          1. 7.3.5.3.1 LED Open Detection
          2. 7.3.5.3.2 Read LED Open Information
          3. 7.3.5.3.3 LED Open Caterpillar Removal
        4. 7.3.5.4 LED Short and Weak Short Circuitry Detection and Removal
          1. 7.3.5.4.1 LED Short/Weak Short Detection
          2. 7.3.5.4.2 Read LED Short Information
          3. 7.3.5.4.3 LSD Caterpillar Removal
    4. 7.4 Device Functional Modes
    5. 7.5 Continuous Clock Series Interface
      1. 7.5.1 Data Validity
      2. 7.5.2 CCSI Frame Format
      3. 7.5.3 Write Command
        1. 7.5.3.1 Chip Index Write Command
        2. 7.5.3.2 VSYNC Write Command
        3. 7.5.3.3 MPSM Write Command
        4. 7.5.3.4 Standby Clear and Enable Command
        5. 7.5.3.5 Soft_Reset Command
        6. 7.5.3.6 Data Write Command
      4. 7.5.4 Read Command
    6. 7.6 PWM Grayscale Control
      1. 7.6.1 Grayscale Data Storage and Display
        1. 7.6.1.1 Memory Structure Overview
        2. 7.6.1.2 Details of Memory Bank
        3. 7.6.1.3 Write a Frame Data into Memory Bank
      2. 7.6.2 PWM Control for Display
    7. 7.7 Register Maps
      1. 7.7.1  FC0
      2. 7.7.2  FC1
      3. 7.7.3  FC2
      4. 7.7.4  FC3
      5. 7.7.5  FC4
      6. 7.7.6  FC14
      7. 7.7.7  FC15
      8. 7.7.8  FC16
      9. 7.7.9  FC17
      10. 7.7.10 FC18
      11. 7.7.11 FC19
      12. 7.7.12 FC20
      13. 7.7.13 FC21
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 System Structure
        2. 8.2.1.2 SCLK Frequency
        3. 8.2.1.3 Internal GCLK Frequency
        4. 8.2.1.4 Line Switch Time
        5. 8.2.1.5 Blank Time Removal
        6. 8.2.1.6 BC and CC
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Chip Index Command
        2. 8.2.2.2 FC Registers Settings
        3. 8.2.2.3 Grayscale Data Write
        4. 8.2.2.4 VSYNC Command
        5. 8.2.2.5 LED Open/Short Read
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RRF|76
  • ZXL|96
散热焊盘机械数据 (封装 | 引脚)

10.1 Layout Guidelines

  • Place the decoupling capacitor near the VCC/VR, VG/VB pins and GND plane.
  • Place the current programming resistor RIREF close to IREF pin and GND plane.
  • Route the GND thermal pad as widely as possible for large GND currents. Maximum GND current is approximately 2 A for two devices (96-CH × 20 mA = 1.92 A).
  • The Thermal Pad must be connected to GND plane because the pad is used as power ground pin internally. There is a large current flow through this pad when all channels turn on. Furthermore, this pad must be connected to a heat sink layer by thermal via to reduce device temperature. For more information about suggested thermal via pattern and via size, see PowerPAD™ Thermally Enhanced Package application note.
  • Routing between the LED Anode side and the device OUTXn pin must be as short and straight as possible to reduce wire inductance.
  • The line switch pins must be located in the middle of the matrix, which must be laid out as symmetrically as possible.
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