SNVS358R July   2005  – June 2016 LP5900

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Output and Input Capacitor, Recommended Specifications
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 No-Load Stability
      2. 7.3.2 Enable Control
      3. 7.3.3 Low Noise Output
      4. 7.3.4 Thermal-Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with Enable Control
      2. 7.4.2 Operation with Minimum Operating Input Voltage (VIN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation
        2. 8.2.2.2 External Capacitors
          1. 8.2.2.2.1 Input Capacitor
          2. 8.2.2.2.2 Output Capacitor
          3. 8.2.2.2.3 Capacitor Characteristics
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 DSBGA Mounting
    4. 10.4 DSBGA Light Sensitivity
    5. 10.5 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

YZR and YPF Packages
4-Pin DSBGA
LP5900 connection_diagram_dsbga_nvs358.gif
NGF Package
6-Pin WSON with Exposed Thermal Pad
LP5900 WSON_package.gif

Pin Functions

PIN TYPE DESCRIPTION
DSBGA WSON NAME
A1 4 EN I Enable input; disables the regulator when ≤ 0.4 V. Enables the regulator when ≥ 1.2 V. An internal 1-MΩ pull-down resistor connects this input to ground.
A2 6 IN I Input voltage supply. Connect a 0.47-µF capacitor at this input.
B1 3 GND — Common ground
B2 1 OUT O Output voltage. A 0.47-μF Low ESR capacitor should be connected to this pin. Connect this output to the load circuit.
— 2 NC — No internal connection.
— Thermal Pad Thermal Pad — The exposed thermal pad on the bottom of the packagemust be connected to a copper area on the PCB under the package. TI recommends use of thermal vias to remove heat from the package into the PCB. Connect the thermal pad to ground potential or leave floating. Do not connect the thermal pad to any potential other than the same ground potential seen at device pin 3. For additional information on using TI's non-pullback WSON package, see AN-1187 Leadless Leadframe Package (LLP) (SNOA401).
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