ZHCSD11D September   2014  – December 2018 LP5907-Q1

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Output and Input Capacitors
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LP5907-Q1 Voltage Options
      2. 7.3.2 Enable (EN)
      3. 7.3.3 Low Output Noise
      4. 7.3.4 Output Automatic Discharge
      5. 7.3.5 Remote Output Capacitor Placement
      6. 7.3.6 Thermal Overload Protection (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Minimum Operating Input Voltage (VIN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation and Device Operation
        2. 8.2.2.2 External Capacitors
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Output Capacitor
        5. 8.2.2.5 Capacitor Characteristics
        6. 8.2.2.6 Remote Capacitor Operation
        7. 8.2.2.7 No-Load Stability
        8. 8.2.2.8 Enable Control
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from C Revision (May 2018) to D Revision

  • Added 向文档添加了 DQN (X2SON) 封装（预览版）Go
  • Added Layout Example for the DQN Package figureGo

Changes from B Revision (September 2016) to C Revision

  • Added 向特性 部分中添加了 ESD 分类级别子项目Go
  • Changed DBV values in Thermal Information table Go
  • Deleted footnote 1 from Thermal Information table Go
  • Added Overshoot on start-up with EN row to Electrical Characteristics table Go
  • Changed Device Comparison table: changed table title, added new rows and new data, moved to new sub-section Go

Changes from A Revision (June 2016) to B Revision

  • Changed 标题措辞Go
  • Changed 将“低输出电压噪声：小于 10µVRMS”更改成了“低输出电压噪声：小于 6.5µVRMS”Go
  • Changed 更改了“应用”中所列的项目Go
  • Changed 更改了说明中第一个句子的措辞Go

Changes from * Revision (September 2014) to A Revision

  • Added 特性项目修改：汽车 Go
  • Added TI 设计的顶部导航图标Go
  • Changed “线性稳压器”更改为“LDO”Go
  • Changed storage temperature from Handling Ratings to Abs Max table; replaced Handling Ratings with ESD Ratings per new format Go
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