ZHCSOW8 July   2022 LP5912-EP

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Output and Input Capacitors
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Output Automatic Discharge (RAD)
      3. 7.3.3 Reverse Current Protection (IRO)
      4. 7.3.4 Internal Current Limit (ISC)
      5. 7.3.5 Thermal Overload Protection (TSD)
      6. 7.3.6 Power-Good Output (PG)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Minimum Operating Input Voltage (VIN)
  8. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
        2. 8.2.2.2 Input Capacitor
        3. 8.2.2.3 Output Capacitor
        4. 8.2.2.4 Capacitor Characteristics
        5. 8.2.2.5 Remote Capacitor Operation
        6. 8.2.2.6 Power Dissipation
        7. 8.2.2.7 Estimating Junction Temperature
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
  10. 10Electrostatic Discharge Caution
  11. 11术语表
  12. 12Mechanical, Packaging, and Orderable Information

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Remote Capacitor Operation

To ensure stability, the LP5912-EP requires at least a 1-μF capacitor at the OUT pin. There is no strict requirement for the location of the output capacitor in regards to the LDO OUT pin; the output capacitor can be located 5 cm to 10 cm away from the LDO. This flexibility means that there is no need to have a special capacitor close to the OUT pin if there are already respective capacitors in the system. This placement flexibility requires that the output capacitor be connected directly between the LP5912-EP OUT pin and GND pin with no vias. This remote capacitor feature can help designers minimize the number of capacitors in the system.

As a good design practice, keep the wiring parasitic inductance at a minimum. Thus, use traces that are as wide as possible from the LDO output to the capacitors, keeping the LDO output trace layer as close to ground layer as possible and avoiding vias on the path. If there is a need to use vias, implement as many vias as possible between the connection layers. Keep parasitic wiring inductance less than 35 nH. For applications with fast load transients, use an input capacitor equal to (or larger than) the sum of the capacitance at the output node for the best load-transient performance.