7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
|
MIN |
MAX |
UNIT |
| VDD |
–0.3 |
24 |
V |
| Voltage on Logic Pins (SCL, SDA, PWM) |
–0.3 |
6 |
| Voltage on Analog Pins (VLDO, EN / VDDIO) |
–0.3 |
6 |
| Voltage on Analog Pins (FSET, ISET) |
–0.3 |
VLDO + 0.3 |
| V (LED1...LED6, SW, VBOOST) |
–0.3 |
50 |
| Junction Temperature (TJ-MAX)(3) |
|
125 |
°C |
| Maximum Lead Temperature (Soldering) |
|
260 |
°C |
| Storage temperature, Tstg |
–65 |
150 |
°C |
(1) Stresses beyond those listed under
Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability, see the
Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).