SNVSB23 March   2018 LP87521-Q1 , LP87522-Q1 , LP87523-Q1 , LP87524-Q1 , LP87525-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Simplified Schematic
  3. 3 Description
    1.     Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Serial Bus Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Descriptions
      1. 8.3.1 Multi-Phase DC/DC Converters
        1. 8.3.1.1 Overview
        2. 8.3.1.2 Multiphase Operation, Phase Adding, and Phase-Shedding
        3. 8.3.1.3 Transition Between PWM and PFM Modes
        4. 8.3.1.4 Multiphase Switcher Configurations
        5. 8.3.1.5 Buck Converter Load-Current Measurement
        6. 8.3.1.6 Spread-Spectrum Mode
      2. 8.3.2 Sync Clock Functionality
      3. 8.3.3 Power-Up
      4. 8.3.4 Regulator Control
        1. 8.3.4.1 Enabling and Disabling Regulators
        2. 8.3.4.2 Changing Output Voltage
      5. 8.3.5 Enable and Disable Sequences
      6. 8.3.6 Device Reset Scenarios
      7. 8.3.7 Diagnosis and Protection Features
        1. 8.3.7.1 Power-Good Information (PGOOD Pin)
        2. 8.3.7.2 Warnings for Diagnosis (Interrupt)
          1. 8.3.7.2.1 Output Power Limit
          2. 8.3.7.2.2 Thermal Warning
        3. 8.3.7.3 Protection (Regulator Disable)
          1. 8.3.7.3.1 Short-Circuit and Overload Protection
          2. 8.3.7.3.2 Overvoltage Protection
          3. 8.3.7.3.3 Thermal Shutdown
        4. 8.3.7.4 Fault (Power Down)
          1. 8.3.7.4.1 Undervoltage Lockout
      8. 8.3.8 GPIO Signal Operation
      9. 8.3.9 Digital Signal Filtering
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
    5. 8.5 Programming
      1. 8.5.1 I2C-Compatible Interface
        1. 8.5.1.1 Data Validity
        2. 8.5.1.2 Start and Stop Conditions
        3. 8.5.1.3 Transferring Data
        4. 8.5.1.4 I2C-Compatible Chip Address
        5. 8.5.1.5 Auto-Increment Feature
    6. 8.6 Register Maps
      1. 8.6.1 Register Descriptions
        1. 8.6.1.1  OTP_REV
        2. 8.6.1.2  BUCK0_CTRL1
        3. 8.6.1.3  BUCK1_CTRL1
        4. 8.6.1.4  BUCK2_CTRL1
        5. 8.6.1.5  BUCK3_CTRL1
        6. 8.6.1.6  BUCK0_VOUT
        7. 8.6.1.7  BUCK0_FLOOR_VOUT
        8. 8.6.1.8  BUCK1_VOUT
        9. 8.6.1.9  BUCK1_FLOOR_VOUT
        10. 8.6.1.10 BUCK2_VOUT
        11. 8.6.1.11 BUCK2_FLOOR_VOUT
        12. 8.6.1.12 BUCK3_VOUT
        13. 8.6.1.13 BUCK3_FLOOR_VOUT
        14. 8.6.1.14 BUCK0_DELAY
        15. 8.6.1.15 BUCK1_DELAY
        16. 8.6.1.16 BUCK2_DELAY
        17. 8.6.1.17 BUCK3_DELAY
        18. 8.6.1.18 GPIO2_DELAY
        19. 8.6.1.19 GPIO3_DELAY
        20. 8.6.1.20 RESET
        21. 8.6.1.21 CONFIG
        22. 8.6.1.22 INT_TOP1
        23. 8.6.1.23 INT_TOP2
        24. 8.6.1.24 INT_BUCK_0_1
        25. 8.6.1.25 INT_BUCK_2_3
        26. 8.6.1.26 TOP_STAT
        27. 8.6.1.27 BUCK_0_1_STAT
        28. 8.6.1.28 BUCK_2_3_STAT
        29. 8.6.1.29 TOP_MASK1
        30. 8.6.1.30 TOP_MASK2
        31. 8.6.1.31 BUCK_0_1_MASK
        32. 8.6.1.32 BUCK_2_3_MASK
        33. 8.6.1.33 SEL_I_LOAD
        34. 8.6.1.34 I_LOAD_2
        35. 8.6.1.35 I_LOAD_1
        36. 8.6.1.36 PGOOD_CTRL1
        37. 8.6.1.37 PGOOD_CTRL2
        38. 8.6.1.38 PGOOD_FLT
        39. 8.6.1.39 PLL_CTRL
        40. 8.6.1.40 PIN_FUNCTION
        41. 8.6.1.41 GPIO_CONFIG
        42. 8.6.1.42 GPIO_IN
        43. 8.6.1.43 GPIO_OUT
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Inductor Selection
        2. 9.2.1.2 Input Capacitor Selection
        3. 9.2.1.3 Output Capacitor Selection
        4. 9.2.1.4 Snubber Components
        5. 9.2.1.5 Supply Filtering Components
        6. 9.2.1.6 Current Limit vs. Maximum Output Current
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RNF|26
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.6 I2C Serial Bus Timing Requirements

These specifications are ensured by design. VIN_Bx = 3.7 V, unless otherwise noted.
MIN MAX UNIT
ƒSCL Serial clock frequency Standard mode 100 kHz
Fast mode 400
Fast mode+ 1 MHz
High-speed mode, Cb = 100 pF 3.4
High-speed mode, Cb = 400 pF 1.7
tLOW SCL low time Standard mode 4.7 µs
Fast mode 1.3
Fast mode+ 0.5
High-speed mode, Cb = 100 pF 160 ns
High-speed mode, Cb = 400 pF 320
tHIGH SCL high time Standard mode 4 µs
Fast mode 0.6
Fast mode+ 0.26
High-speed mode, Cb = 100 pF 60 ns
High-speed mode, Cb = 400 pF 120
tSU;DAT Data setup time Standard mode 250 ns
Fast mode 100
Fast mode+ 50
High-speed mode 10
tHD;DAT Data hold time Standard mode 10 3450 ns
Fast mode 10 900
Fast mode+ 10
High-speed mode, Cb = 100 pF 10 70 ns
High-speed mode, Cb = 400 pF 10 150
tSU;STA Setup time for a start or a repeated start condition Standard mode 4.7 µs
Fast mode 0.6
Fast mode+ 0.26
High-speed mode 160 ns
tHD;STA Hold time for a start or a repeated start condition Standard mode 4 µs
Fast mode 0.6
Fast mode+ 0.26
High-speed mode 160 ns
tBUF Bus free time between a stop and start condition Standard mode 4.7 µs
Fast mode 1.3
Fast mode+ 0.5
tSU;STO Setup time for a stop condition Standard mode 4 µs
Fast mode 0.6
Fast mode+ 0.26
High-speed mode 160 ns
trDA Rise time of SDA signal Standard mode 1000 ns
Fast mode 20 300
Fast mode+ 120
High-speed mode, Cb = 100 pF 10 80
High-speed mode, Cb = 400 pF 20 160
tfDA Fall time of SDA signal Standard mode 300 ns
Fast mode 20 × (VDD / 5.5 V) 300
Fast mode+ 20 × (VDD / 5.5 V) 120
High-speed mode, Cb = 100 pF 10 80
High-speed mode, Cb = 400 pF 30 160
trCL Rise time of SCL signal Standard mode 1000 ns
Fast mode 20 300
Fast mode+ 120
High-speed mode, Cb = 100 pF 10 40
High-speed mode, Cb = 400 pF 20 80
trCL1 Rise time of SCL signal after a repeated start condition and after an acknowledge bit High-speed mode, Cb = 100 pF 10 80 ns
High-speed mode, Cb = 400 pF 20 160
tfCL Fall time of a SCL signal Standard mode 300 ns
Fast mode 20 × (VDD / 5.5 V) 300
Fast mode+ 20 × (VDD / 5.5 V) 120
High-speed mode, Cb = 100 pF 10 40
High-speed mode, Cb = 400 pF 20 80
Cb Capacitive load for each bus line (SCL and SDA) 400 pF
tSP Pulse width of spike suppressed (SCL and SDA spikes that are less than the indicated width are suppressed) Standard mode, fast mode and fast mode+ 50 ns
High-speed mode 10
LP87521-Q1 LP87522-Q1 LP87523-Q1 LP87524-Q1 LP87525-Q1 30190619.gifFigure 1. I2C Timing
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |