ZHCSJ52A December   2019  – August 2021 LP875701-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Serial Bus Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1 Multi-Phase DC/DC Converters
        1. 7.3.1.1 Overview
        2. 7.3.1.2 Multiphase Switcher Configurations
        3. 7.3.1.3 Buck Converter Load-Current Measurement
        4. 7.3.1.4 Spread-Spectrum Mode
      2. 7.3.2 Sync Clock Functionality
      3. 7.3.3 Power-Up
      4. 7.3.4 Regulator Control
        1. 7.3.4.1 Enabling and Disabling Regulators
      5. 7.3.5 Enable and Disable Sequences
      6. 7.3.6 Device Reset Scenarios
      7. 7.3.7 Diagnosis and Protection Features
        1. 7.3.7.1 Power-Good Information (PGOOD pin)
        2. 7.3.7.2 Warnings for Diagnosis (Interrupt)
          1. 7.3.7.2.1 Output Power Limit
          2. 7.3.7.2.2 Thermal Warning
        3. 7.3.7.3 Protection (Regulator Disable)
          1. 7.3.7.3.1 Short-Circuit and Overload Protection
          2. 7.3.7.3.2 Overvoltage Protection
          3. 7.3.7.3.3 Thermal Shutdown
        4. 7.3.7.4 Fault (Power Down)
          1. 7.3.7.4.1 Undervoltage Lockout
      8. 7.3.8 GPIO Signal Operation
      9. 7.3.9 Digital Signal Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
        1.       53
        2. 7.6.1.1  DEV_REV
        3. 7.6.1.2  OTP_REV
        4. 7.6.1.3  BUCK0_CTRL1
        5. 7.6.1.4  BUCK0_DELAY
        6. 7.6.1.5  GPIO2_DELAY
        7. 7.6.1.6  GPIO3_DELAY
        8. 7.6.1.7  RESET
        9. 7.6.1.8  CONFIG
        10. 7.6.1.9  INT_TOP1
        11. 7.6.1.10 INT_TOP2
        12. 7.6.1.11 INT_BUCK_0_1
        13. 7.6.1.12 INT_BUCK_2_3
        14. 7.6.1.13 TOP_STAT
        15. 7.6.1.14 BUCK_0_1_STAT
        16. 7.6.1.15 BUCK_2_3_STAT
        17. 7.6.1.16 TOP_MASK1
        18. 7.6.1.17 TOP_MASK2
        19. 7.6.1.18 BUCK_0_1_MASK
        20. 7.6.1.19 BUCK_2_3_MASK
        21. 7.6.1.20 SEL_I_LOAD
        22. 7.6.1.21 I_LOAD_2
        23. 7.6.1.22 I_LOAD_1
        24. 7.6.1.23 PGOOD_CTRL1
        25. 7.6.1.24 PGOOD_CTRL2
        26. 7.6.1.25 PGOOD_FLT
        27. 7.6.1.26 PLL_CTRL
        28. 7.6.1.27 PIN_FUNCTION
        29. 7.6.1.28 GPIO_CONFIG
        30. 7.6.1.29 GPIO_IN
        31. 7.6.1.30 GPIO_OUT
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Inductor Selection
        2. 8.2.1.2 Input Capacitor Selection
        3. 8.2.1.3 Output Capacitor Selection
        4. 8.2.1.4 Snubber Components
        5. 8.2.1.5 Supply Filtering Components
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)LP875701-Q1 UNIT
RNF (VQFN-HR)
26 PINS
RθJAJunction-to-ambient thermal resistance34.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance16.5°C/W
RθJBJunction-to-board thermal resistance4.7°C/W
ψJTJunction-to-top characterization parameter0.6°C/W
ψJBJunction-to-board characterization parameter4.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance1.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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