ZHCSLV4 December   2020 LP875761-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Serial Bus Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1 Multi-Phase DC/DC Converters
        1. 7.3.1.1 Overview
        2. 7.3.1.2 Multiphase Switcher Configurations
        3. 7.3.1.3 Buck Converter Load-Current Measurement
        4. 7.3.1.4 Spread-Spectrum Mode
      2. 7.3.2 Sync Clock Functionality
      3. 7.3.3 Power-Up
      4. 7.3.4 Regulator Control
        1. 7.3.4.1 Enabling and Disabling Regulators
      5. 7.3.5 Enable and Disable Sequences
      6. 7.3.6 Device Reset Scenarios
      7. 7.3.7 Diagnosis and Protection Features
        1. 7.3.7.1 Power-Good Information (PGOOD pin)
        2. 7.3.7.2 Warnings for Diagnosis (Interrupt)
          1. 7.3.7.2.1 Output Power Limit
          2. 7.3.7.2.2 Thermal Warning
        3. 7.3.7.3 Protection (Regulator Disable)
          1. 7.3.7.3.1 Short-Circuit and Overload Protection
          2. 7.3.7.3.2 Overvoltage Protection
          3. 7.3.7.3.3 Thermal Shutdown
        4. 7.3.7.4 Fault (Power Down)
          1. 7.3.7.4.1 Undervoltage Lockout
      8. 7.3.8 GPIO Signal Operation
      9. 7.3.9 Digital Signal Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
        1.       53
        2. 7.6.1.1  DEV_REV
        3. 7.6.1.2  OTP_REV
        4. 7.6.1.3  BUCK0_CTRL1
        5. 7.6.1.4  BUCK0_CTRL2
        6. 7.6.1.5  BUCK1_CTRL2
        7. 7.6.1.6  BUCK2_CTRL2
        8. 7.6.1.7  BUCK3_CTRL2
        9. 7.6.1.8  BUCK0_DELAY
        10. 7.6.1.9  GPIO2_DELAY
        11. 7.6.1.10 GPIO3_DELAY
        12. 7.6.1.11 RESET
        13. 7.6.1.12 CONFIG
        14. 7.6.1.13 INT_TOP1
        15. 7.6.1.14 INT_TOP2
        16. 7.6.1.15 INT_BUCK_0_1
        17. 7.6.1.16 INT_BUCK_2_3
        18. 7.6.1.17 TOP_STAT
        19. 7.6.1.18 BUCK_0_1_STAT
        20. 7.6.1.19 BUCK_2_3_STAT
        21. 7.6.1.20 TOP_MASK1
        22. 7.6.1.21 TOP_MASK2
        23. 7.6.1.22 BUCK_0_1_MASK
        24. 7.6.1.23 BUCK_2_3_MASK
        25. 7.6.1.24 SEL_I_LOAD
        26. 7.6.1.25 I_LOAD_2
        27. 7.6.1.26 I_LOAD_1
        28. 7.6.1.27 PGOOD_CTRL1
        29. 7.6.1.28 PGOOD_CTRL2
        30. 7.6.1.29 PGOOD_FLT
        31. 7.6.1.30 PLL_CTRL
        32. 7.6.1.31 PIN_FUNCTION
        33. 7.6.1.32 GPIO_CONFIG
        34. 7.6.1.33 GPIO_IN
        35. 7.6.1.34 GPIO_OUT
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Inductor Selection
        2. 8.2.1.2 Input Capacitor Selection
        3. 8.2.1.3 Output Capacitor Selection
        4. 8.2.1.4 Snubber Components
        5. 8.2.1.5 Supply Filtering Components
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RNF|26
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) LP875761-Q1UNIT
RNF (VQFN-HR)
26 PINS
RθJAJunction-to-ambient thermal resistance34.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance16.5°C/W
RθJBJunction-to-board thermal resistance4.7°C/W
ψJTJunction-to-top characterization parameter0.6°C/W
ψJBJunction-to-board characterization parameter4.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance1.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |