米6体育平台手机版

ZHCSDQ0C March 2015 – August 2018 LP8758-B0

PRODUCTION DATA.

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机械数据 (封装 | 引脚)

YFF|35
- MXBG315

散热焊盘机械数据 (封装 | 引脚)

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7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾

		MIN	MAX	UNIT
INPUT VOLTAGE
VIN_Bx, VANA	Voltage on power connections	–0.3	6	V
SW_Bx	Voltage on buck switch nodes	–0.3	(VIN_Bx + 0.3 ) with 6 V max	V
FB_Bx	Voltage on buck voltage sense nodes	–0.3	(VANA + 0.3 ) with 6 V max	V
NRST	Voltage on NRST input	–0.3	3.6	V
ENx, SDA, SCL, nINT	Voltage on logic pins (input or output pins)	–0.3	3.6	V
CURRENT
VIN_Bx, SW_Bx, PGND_Bx	Current on power pins (average current over 100k hour lifetime, T_J = 125°C)		0.62	A/pin
TEMPERATURE
Junction temperature, T_J-MAX		−40	150	°C
Storage temperature, T_stg		–65	150	°C
Maximum lead temperature (soldering, 10 sec.)⁽³⁾			260	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground.

(3) For detailed soldering specifications and information, refer to AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009).