ZHCSNW7
April 2021
LP8758-EA
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
I2C Serial Bus Timing Requirements
6.7
Switching Characteristics
6.8
Typical Characteristics
7
Detailed Description
7.1
Overview
7.1.1
Buck Information
7.1.1.1
Operating Modes
7.1.1.2
Programmability
7.1.1.3
特性
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Overview
7.3.1.1
Transition Between PWM and PFM Modes
7.3.1.2
Buck Converter Load Current Measurement
7.3.1.3
Spread-Spectrum Mode
7.3.2
Power-Up
7.3.3
Regulator Control
7.3.3.1
Enabling and Disabling
7.3.3.2
Changing Output Voltage
7.3.4
Device Reset Scenarios
7.3.5
Diagnosis and Protection Features
7.3.5.1
Warnings for Diagnosis (Interrupt)
7.3.5.1.1
Output Current Limit
7.3.5.1.2
Thermal Warning
7.3.5.2
Protection (Regulator Disable)
7.3.5.2.1
Short-Circuit and Overload Protection
7.3.5.2.2
Thermal Shutdown
7.3.5.3
Fault (Power Down)
7.3.5.3.1
Undervoltage Lockout
7.3.6
Digital Signal Filtering
7.4
Device Functional Modes
7.4.1
Modes of Operation
7.5
Programming
7.5.1
I2C-Compatible Interface
7.5.1.1
Data Validity
7.5.1.2
Start and Stop Conditions
7.5.1.3
Transferring Data
7.5.1.4
I2C-Compatible Chip Address
7.5.1.5
Auto Increment Feature
7.6
Register Maps
7.6.1
Register Descriptions
7.6.1.1
OTP_REV
7.6.1.2
BUCK0_CTRL1
7.6.1.3
BUCK0_CTRL2
7.6.1.4
BUCK1_CTRL1
7.6.1.5
BUCK1_CTRL2
7.6.1.6
BUCK2_CTRL1
7.6.1.7
BUCK2_CTRL2
7.6.1.8
BUCK3_CTRL1
7.6.1.9
BUCK3_CTRL2
7.6.1.10
BUCK0_VOUT
7.6.1.11
BUCK0_FLOOR_VOUT
7.6.1.12
BUCK1_VOUT
7.6.1.13
BUCK1_FLOOR_VOUT
7.6.1.14
BUCK2_VOUT
7.6.1.15
BUCK2_FLOOR_VOUT
7.6.1.16
BUCK3_VOUT
7.6.1.17
BUCK3_FLOOR_VOUT
7.6.1.18
BUCK0_DELAY
7.6.1.19
BUCK1_DELAY
7.6.1.20
BUCK2_DELAY
7.6.1.21
BUCK3_DELAY
7.6.1.22
RESET
7.6.1.23
CONFIG
7.6.1.24
INT_TOP
7.6.1.25
INT_BUCK_0_1
7.6.1.26
INT_BUCK_2_3
7.6.1.27
TOP_STAT
7.6.1.28
BUCK_0_1_STAT
7.6.1.29
BUCK_2_3_STAT
7.6.1.30
TOP_MASK
7.6.1.31
BUCK_0_1_MASK
7.6.1.32
BUCK_2_3_MASK
7.6.1.33
SEL_I_LOAD
7.6.1.34
I_LOAD_2
7.6.1.35
I_LOAD_1
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Application Components
8.2.2.1.1
Inductor Selection
8.2.2.1.2
Input Capacitor Selection
8.2.2.1.3
Output Capacitor Selection
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.2
Documentation Support
11.2.1
Related Documentation
11.3
接收文档更新通知
11.4
支持资源
11.5
Trademarks
11.6
静电放电警告
11.7
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
YFF|35
MXBG315
散热焊盘机械数据 (封装 | 引脚)
11.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。
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