ZHCSNW7 April   2021 LP8758-EA

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Serial Bus Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Buck Information
        1. 7.1.1.1 Operating Modes
        2. 7.1.1.2 Programmability
        3. 7.1.1.3 特性
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overview
        1. 7.3.1.1 Transition Between PWM and PFM Modes
        2. 7.3.1.2 Buck Converter Load Current Measurement
        3. 7.3.1.3 Spread-Spectrum Mode
      2. 7.3.2 Power-Up
      3. 7.3.3 Regulator Control
        1. 7.3.3.1 Enabling and Disabling
        2. 7.3.3.2 Changing Output Voltage
      4. 7.3.4 Device Reset Scenarios
      5. 7.3.5 Diagnosis and Protection Features
        1. 7.3.5.1 Warnings for Diagnosis (Interrupt)
          1. 7.3.5.1.1 Output Current Limit
          2. 7.3.5.1.2 Thermal Warning
        2. 7.3.5.2 Protection (Regulator Disable)
          1. 7.3.5.2.1 Short-Circuit and Overload Protection
          2. 7.3.5.2.2 Thermal Shutdown
        3. 7.3.5.3 Fault (Power Down)
          1. 7.3.5.3.1 Undervoltage Lockout
      6. 7.3.6 Digital Signal Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1  OTP_REV
        2. 7.6.1.2  BUCK0_CTRL1
        3. 7.6.1.3  BUCK0_CTRL2
        4. 7.6.1.4  BUCK1_CTRL1
        5. 7.6.1.5  BUCK1_CTRL2
        6. 7.6.1.6  BUCK2_CTRL1
        7. 7.6.1.7  BUCK2_CTRL2
        8. 7.6.1.8  BUCK3_CTRL1
        9. 7.6.1.9  BUCK3_CTRL2
        10. 7.6.1.10 BUCK0_VOUT
        11. 7.6.1.11 BUCK0_FLOOR_VOUT
        12. 7.6.1.12 BUCK1_VOUT
        13. 7.6.1.13 BUCK1_FLOOR_VOUT
        14. 7.6.1.14 BUCK2_VOUT
        15. 7.6.1.15 BUCK2_FLOOR_VOUT
        16. 7.6.1.16 BUCK3_VOUT
        17. 7.6.1.17 BUCK3_FLOOR_VOUT
        18. 7.6.1.18 BUCK0_DELAY
        19. 7.6.1.19 BUCK1_DELAY
        20. 7.6.1.20 BUCK2_DELAY
        21. 7.6.1.21 BUCK3_DELAY
        22. 7.6.1.22 RESET
        23. 7.6.1.23 CONFIG
        24. 7.6.1.24 INT_TOP
        25. 7.6.1.25 INT_BUCK_0_1
        26. 7.6.1.26 INT_BUCK_2_3
        27. 7.6.1.27 TOP_STAT
        28. 7.6.1.28 BUCK_0_1_STAT
        29. 7.6.1.29 BUCK_2_3_STAT
        30. 7.6.1.30 TOP_MASK
        31. 7.6.1.31 BUCK_0_1_MASK
        32. 7.6.1.32 BUCK_2_3_MASK
        33. 7.6.1.33 SEL_I_LOAD
        34. 7.6.1.34 I_LOAD_2
        35. 7.6.1.35 I_LOAD_1
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Application Components
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Input Capacitor Selection
          3. 8.2.2.1.3 Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

6.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±2000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |