The thermal shutdown detector monitors the temperature on the die. If the junction reaches a temperature at which damage can occur, a switch-off transition is initiated and a thermal shutdown event is written into a status register. There are two levels of thermal shutdown threshold. When the die temperature reaches the T_{SD_orderly} level, the LP8764-Q1 device performs an orderly shutdown of all output power rails. If the die temperature raises rapidly and reaches the T_{SD_imm} level before the orderly shutdown process completes, the LP8764-Q1 device performs an immediate shutdown with activated pull-down on all output power rails, in order to turn off all of the output power rails as rapidly as possible. After the thermal shutdown takes place, the system cannot restart until the die temperature is below the thermal warning threshold.