ZHCSIH0C
December 2017 – June 2021
LP87702-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
说明(续)
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
I2C Serial Bus Timing Parameters
7.7
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Descriptions
8.3.1
Step-Down DC/DC Converters
8.3.1.1
Overview
8.3.1.2
Transition Between PWM and PFM Modes
8.3.1.3
Buck Converter Load Current Measurement
8.3.2
Boost Converter
8.3.3
Spread-Spectrum Mode
8.3.4
Sync Clock Functionality
8.3.5
Power-Up
8.3.6
Buck and Boost Control
8.3.6.1
Enabling and Disabling Converters
8.3.6.2
Changing Buck Output Voltage
8.3.7
Enable and Disable Sequences
8.3.8
Window Watchdog
8.3.9
Device Reset Scenarios
8.3.10
Diagnostics and Protection Features
8.3.10.1
Voltage Monitorings
8.3.10.2
Interrupts
8.3.10.3
Power-Good Information to Interrupt, PG0, and PG1 Pins
8.3.10.3.1
PGx Pin Gated (Unusual) Mode
8.3.10.3.2
PGx Pin Operation in Continuous Mode
8.3.10.3.3
Summary of PG0, PG1 Gated, and Continuous Operating Modes
8.3.10.4
Warning Interrupts for System Level Diagnostics
8.3.10.4.1
Output Power Limit
8.3.10.4.2
Thermal Warning
8.3.10.5
Protections Causing Converter Disable
8.3.10.5.1
Short-Circuit and Overload Protection
8.3.10.5.2
Overvoltage Protection
8.3.10.5.3
Thermal Shutdown
8.3.10.6
Protections Causing Device Power Down
8.3.10.6.1
Undervoltage Lockout
8.3.11
OTP Error Correction
8.3.12
Operation of GPO Signals
8.3.13
Digital Signal Filtering
8.4
Device Functional Modes
8.4.1
Modes of Operation
8.5
Programming
8.5.1
I2C-Compatible Interface
8.5.1.1
Data Validity
8.5.1.2
Start and Stop Conditions
8.5.1.3
Transferring Data
8.5.1.4
I2C-Compatible Chip Address
8.5.1.5
Auto Increment Feature
8.6
Register Maps
8.6.1
Register Descriptions
8.6.1.1
LP8770_map Registers
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Application Components
9.2.2.1.1
Inductor Selection
9.2.2.1.2
Buck Input Capacitor Selection
9.2.2.1.3
Buck Output Capacitor Selection
9.2.2.1.4
Boost Input Capacitor Selection
9.2.2.1.5
Boost Output Capacitor Selection
9.2.2.1.6
Supply Filtering Components
9.2.3
Current Limit vs Maximum Output Current
9.2.4
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
第三方米6体育平台手机版_好二三四免责声明
12.2
Receiving Notification of Documentation Updates
12.3
支持资源
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RHB|32
MPQF130D
散热焊盘机械数据 (封装 | 引脚)
RHB|32
QFND590
订购信息
zhcsih0c_oa
zhcsih0c_pm
8.5
Programming
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