米6体育平台手机版

ZHCSIH0C December 2017 – June 2021 LP87702-Q1

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

RHB|32
- MPQF130D

散热焊盘机械数据 (封装 | 引脚)

RHB|32
- QFND590

订购信息

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)⁽¹⁾ ⁽²⁾

		MIN	MAX	UNIT
VIN_B0, VIN_B1, SW_BST, VANA	Voltage on input power connections	–0.3	6	V
SW_B0, SW_B1	Voltage on buck switch nodes	–0.3	(VIN_Bx + 0.3 V) with 6-V maximum	V
FB_B0, FB_B1	Voltage on buck voltage sense nodes	–0.3	(VANA + 0.3 V) with 6-V maximum	V
VOUT_BST	Voltage on boost output	–0.3	6	V
SCL (EN2), SDA (EN3), VMON1, VMON2	Voltage on voltage monitoring pins	–0.3	(VANA + 0.3 V) with 6-V maximum	V
NRST, EN1, nINT	Voltage on logic pins (input or output pins)	–0.3	6	V
PG0, PG1 (GPO1), GPO0, CLKIN (GPO2), WDI, WD_RESET	Voltage on logic pins (input or output pins)	–0.3	(VANA + 0.3 V) with 6-V maximum	V
T_J-MAX	Junction temperature	−40	150	°C
T_stg	Storage temperature	–65	150	°C
Maximum lead temperature (soldering, 10 sec.)			260	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground.