7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)(1)(2)
|
MIN |
MAX |
UNIT |
| Voltage on pins VSENSE_N, VSENSE_P, OUT1 to OUT4, FB, SD |
–0.3 |
52 |
V |
| Voltage on pins VDD, FILTER, SYNC, VSYNC, PWM, SCLK/SCL, MOSI/SDA, MISO, NSS, VDDIO/EN, IF, ISENSE, ISENSE_GND, FAULT, ISET, TSENSE, C1N |
–0.3 |
6 |
V |
| Voltage on pins C1P, CPUMP, GD, SQW |
–0.3 |
12 |
V |
| Continuous power dissipation(3)
|
Internally Limited |
|
| Ambient temperature, TA(4)
|
–40 |
125 |
°C |
| Junction temperature, TJ(4)
|
–40 |
150 |
°C |
| Maximum lead temperature (soldering) |
|
See(5)
|
°C |
| Storage temperature, Tstg
|
–65 |
150 |
°C |
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pins.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 165°C (typical) and disengages at TJ = 135°C (typical).
(4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 150°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX ).
(5) For detailed soldering specifications and information, refer to PowerPAD™ Thermally Enhanced Package Application Note .