ZHCSLM9B August   2020  – May 2024 LP8866S-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Logic Interface Characteristics
    7. 5.7 Timing Requirements for I2C Interface
    8.     14
    9. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Control Interface
      2. 6.3.2 Function Setting
      3. 6.3.3 Device Supply (VDD)
      4. 6.3.4 Enable (EN)
      5. 6.3.5 Charge Pump
      6. 6.3.6 Boost Controller
        1. 6.3.6.1 Boost Cycle-by-Cycle Current Limit
        2. 6.3.6.2 Controller Min On/Off Time
        3. 6.3.6.3 Boost Adaptive Voltage Control
          1. 6.3.6.3.1 FB Divider Using Two-Resistor Method
          2. 6.3.6.3.2 FB Divider Using Three-Resistor Method
          3. 6.3.6.3.3 FB Divider Using External Compensation
        4. 6.3.6.4 Boost Sync and Spread Spectrum
        5. 6.3.6.5 Boost Output Discharge
        6. 6.3.6.6 Light Load Mode
      7. 6.3.7 LED Current Sinks
        1. 6.3.7.1 LED Output Current Setting
        2. 6.3.7.2 LED Output String Configuration
        3. 6.3.7.3 LED Output PWM Clock Generation
      8. 6.3.8 Brightness Control
        1. 6.3.8.1 Brightness Control Signal Path
        2. 6.3.8.2 Dimming Mode
        3. 6.3.8.3 LED Dimming Frequency
        4. 6.3.8.4 Phase-Shift PWM Mode
        5. 6.3.8.5 Hybrid Mode
        6. 6.3.8.6 Direct PWM Mode
        7. 6.3.8.7 Sloper
        8. 6.3.8.8 PWM Detector Hysteresis
        9. 6.3.8.9 Dither
      9. 6.3.9 Protection and Fault Detections
        1. 6.3.9.1 Supply Faults
          1. 6.3.9.1.1 VIN Undervoltage Faults (VINUVLO)
          2. 6.3.9.1.2 VIN Overvoltage Faults (VINOVP)
          3. 6.3.9.1.3 VDD Undervoltage Faults (VDDUVLO)
          4. 6.3.9.1.4 VIN OCP Faults (VINOCP)
            1. 6.3.9.1.4.1 VIN OCP Current Limit vs. Boost Cycle-by-Cycle Current Limit
          5. 6.3.9.1.5 Charge Pump Faults (CPCAP, CP)
          6. 6.3.9.1.6 CRC Error Faults (CRCERR)
        2. 6.3.9.2 Boost Faults
          1. 6.3.9.2.1 Boost Overvoltage Faults (BSTOVPL, BSTOVPH)
          2. 6.3.9.2.2 Boost Overcurrent Faults (BSTOCP)
          3. 6.3.9.2.3 LEDSET Resistor Missing Faults (LEDSET)
          4. 6.3.9.2.4 MODE Resistor Missing Faults (MODESEL)
          5. 6.3.9.2.5 FSET Resistor Missing Faults (FSET)
          6. 6.3.9.2.6 ISET Resistor Out of Range Faults (ISET)
          7. 6.3.9.2.7 Thermal Shutdown Faults (TSD)
        3. 6.3.9.3 LED Faults
          1. 6.3.9.3.1 Open LED Faults (OPEN_LED)
          2. 6.3.9.3.2 Short LED Faults (SHORT_LED)
          3. 6.3.9.3.3 LED Short to GND Faults (GND_LED)
          4. 6.3.9.3.4 Invalid LED String Faults (INVSTRING)
          5. 6.3.9.3.5 I2C Timeout Faults
        4. 6.3.9.4 Overview of the Fault and Protection Schemes
    4. 6.4 Device Functional Modes
      1. 6.4.1  State Diagram
      2. 6.4.2  Shutdown
      3. 6.4.3  Device Initialization
      4. 6.4.4  Standby Mode
      5. 6.4.5  Power-line FET Soft Start
      6. 6.4.6  Boost Start-Up
      7. 6.4.7  Normal Mode
      8. 6.4.8  Fault Recovery
      9. 6.4.9  Latch Fault
      10. 6.4.10 Start-Up Sequence
    5. 6.5 Programming
      1. 6.5.1 I2C-Compatible Interface
      2. 6.5.2 Programming Examples
        1. 6.5.2.1 General Configuration Registers
        2. 6.5.2.2 Clearing Fault Interrupts
        3. 6.5.2.3 Disabling Fault Interrupts
        4. 6.5.2.4 Diagnostic Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Full Feature Application for Display Backlight
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1  Inductor Selection
          2. 7.2.1.2.2  Output Capacitor Selection
          3. 7.2.1.2.3  Input Capacitor Selection
          4. 7.2.1.2.4  Charge Pump Output Capacitor
          5. 7.2.1.2.5  Charge Pump Flying Capacitor
          6. 7.2.1.2.6  Output Diode
          7. 7.2.1.2.7  Switching FET
          8. 7.2.1.2.8  Boost Sense Resistor
          9. 7.2.1.2.9  Power-Line FET
          10. 7.2.1.2.10 Input Current Sense Resistor
          11. 7.2.1.2.11 Feedback Resistor Divider
          12. 7.2.1.2.12 Critical Components for Design
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Application with Basic/Minimal Operation
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
      3. 7.2.3 SEPIC Mode Application
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
          1. 7.2.3.2.1  Inductor Selection
          2. 7.2.3.2.2  Coupling Capacitor Selection
          3. 7.2.3.2.3  Output Capacitor Selection
          4. 7.2.3.2.4  Input Capacitor Selection
          5. 7.2.3.2.5  Charge Pump Output Capacitor
          6. 7.2.3.2.6  Charge Pump Flying Capacitor
          7. 7.2.3.2.7  Switching FET
          8. 7.2.3.2.8  Output Diode
          9. 7.2.3.2.9  Switching Sense Resistor
          10. 7.2.3.2.10 Power-Line FET
          11. 7.2.3.2.11 Input Current Sense Resistor
          12. 7.2.3.2.12 Feedback Resistor Divider
          13. 7.2.3.2.13 Critical Components for Design
        3. 7.2.3.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3.7.2 LED Output String Configuration

The Six LED driver channels of the LP8866S-Q1 device is configured by the LED_SET resistor, which supports applications using one to Six LED strings. Resistor with 1% accuracy is needed to ensure proper operation. The driver channels can also be tied together in groups of one, two or three. This allows the LP8866S-Q1 device to drive three 300mA LED strings, two 450mA LED strings, or one 900mA LED string. The LED strings are always appropriately phase shifted for their string configuration. This reduces the ripple seen at the boost output, which allows smaller output capacitors and reduces audible ringing in the capacitors. Phase shift increases the load frequency, which can move potential capacitor noise above the audible band while still keeping PWM frequency low to support a higher dimming ratio.

When the LP8866S-Q1 device is firstly powered on, the string configuration is configured by the LED_SET resistor and the phases of each channel are automatically configured. The LED string configuration must not be changed unless the LP8866S-Q1 is powered off in shutdown state. The unused LEDx pins should be tied to ground.

Table 6-6 LED Output String Configuration
R_LED_SET (kΩ) CONFIGURATION OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 AUTOMATIC PHASE SHIFT
3.92 6 Channels 150mA 150mA 150mA 150mA 150mA 150mA 60°
4.75 5 Channels 150mA 150mA 150mA 150mA 150mA (Tied to GND) 72°
5.76 4 Channels 150mA 150mA 150mA 150mA (Tied to GND) (Tied to GND) 90°
7.87 3 Channels 150mA 150mA 150mA (Tied to GND) (Tied to GND) (Tied to GND) 120°
11 2 Channels 150mA 150mA (Tied to GND) (Tied to GND) (Tied to GND) (Tied to GND) 180°
17.8 3 Channels 300mA 300mA 300mA 120°
42.2 2 Channels 450mA 450mA 180°
124 1 Channels 900mA None
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