SNVSB83B June   2019  – January 2020 LP8867-Q1 , LP8869-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
    2.     LED Backlight Efficiency
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Internal LDO Electrical Characteristics
    7. 7.7  Protection Electrical Characteristics
    8. 7.8  Current Sinks Electrical Characteristics
    9. 7.9  PWM Brightness Control Electrical Characteristics
    10. 7.10 Boost and SEPIC Converter Characteristics
    11. 7.11 Logic Interface Characteristics
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Integrated DC-DC Converter
        1. 8.3.1.1 DC-DC Converter Parameter Configuration
          1. 8.3.1.1.1 Switching Frequency
          2. 8.3.1.1.2 Spread Spectrum and External SYNC
          3. 8.3.1.1.3 Recommended Component Value and Internal Parameters
          4. 8.3.1.1.4 DC-DC Converter Switching Current Limit
          5. 8.3.1.1.5 DC-DC Converter Light Load Mode
        2. 8.3.1.2 Adaptive Voltage Control
          1. 8.3.1.2.1 Using Two-Divider
          2. 8.3.1.2.2 Using T-Divider
          3. 8.3.1.2.3 Feedback Capacitor
      2. 8.3.2 Internal LDO
      3. 8.3.3 LED Current Sinks
        1. 8.3.3.1 LED Output Configuration
        2. 8.3.3.2 LED Current Setting
        3. 8.3.3.3 Brightness Control
      4. 8.3.4 Power-Line FET Control
      5. 8.3.5 LED Current Dimming With External Temperature Sensor
      6. 8.3.6 Fault Detections and Protection
        1. 8.3.6.1 Supply Fault and Protection
          1. 8.3.6.1.1 VIN Undervoltage Fault (VIN_UVLO)
          2. 8.3.6.1.2 VIN Overvoltage Fault (VIN_OVP)
          3. 8.3.6.1.3 VIN Overcurrent Fault (VIN_OCP)
        2. 8.3.6.2 Boost Fault and Protection
          1. 8.3.6.2.1 Boost Overvoltage Fault (BST_OVP)
          2. 8.3.6.2.2 SW Overvoltage Fault (SW_OVP)
        3. 8.3.6.3 LED Fault and Protection (LED_OPEN and LED_SHORT)
        4. 8.3.6.4 Thermal Fault and Protection (TSD)
        5. 8.3.6.5 Overview of the Fault and Protection Schemes
    4. 8.4 Device Functional Modes
      1. 8.4.1 STANDBY State
      2. 8.4.2 SOFT START State
      3. 8.4.3 BOOST START State
      4. 8.4.4 NORMAL State
      5. 8.4.5 FAULT RECOVERY State
      6. 8.4.6 State Diagram and Timing Diagram for Start-up and Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Application for 4 LED Strings
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Inductor Selection
        2. 9.2.3.2 Output Capacitor Selection
        3. 9.2.3.3 Input Capacitor Selection
        4. 9.2.3.4 LDO Output Capacitor
        5. 9.2.3.5 Diode
      4. 9.2.4 Application Curves
      5. 9.2.5 SEPIC Mode Application
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
          1. 9.2.5.2.1 Inductor
          2. 9.2.5.2.2 Diode
          3. 9.2.5.2.3 Capacitor C1
        3. 9.2.5.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.3.1.1.2 Spread Spectrum and External SYNC

LP886x-Q1 has an optional spread spectrum feature (±3% from central frequency, 1-kHz modulation frequency) which reduces EMI noise at the switching frequency and its harmonic frequencies. If SYNC pin level is low, spread spectrum function is disabled. If SYNC pin level is high, spread spectrum function is enabled.

LP886x-Q1 DC-DC converter can be driven by an external SYNC signal between 300 kHz and 2.2 MHz. When external synchronization is used, spread spectrum is not available. If the external synchronization input disappears, DC-DC continues operation at the frequency defined by RFSET resistor and spread spectrum function will be enabled/disabled depending on the final SYNC pin level.

External SYNC frequency must be 1.2 to 1.5 times higher than the frequency defined by RFSET resistor. In external SYNC configuration, minimum frequency setting with RFSET could go as low as 250 kHz to support 300-kHz switching with external clock.

Table 1. DC-DC Synchronization Mode

SYNC PIN INPUT MODE
Low Spread spectrum disabled
High Spread spectrum enabled
300 to 2200 kHz frequency Spread spectrum disabled, external synchronization mode
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