ZHCSK37 August   2019 LP8867C-Q1 , LP8869C-Q1

PRODUCTION DATA.  

  1. 1 特性
    1.     简化原理图
  2. 2 应用
  3. 3 说明
    1.     系统效率
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Internal LDO Electrical Characteristics
    7. 7.7  Protection Electrical Characteristics
    8. 7.8  Current Sinks Electrical Characteristics
    9. 7.9  PWM Brightness Control Electrical Characteristics
    10. 7.10 Boost and SEPIC Converter Characteristics
    11. 7.11 Logic Interface Characteristics
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Integrated DC-DC Converter
        1. 8.3.1.1 DC-DC Converter Parameter Configuration
          1. 8.3.1.1.1 Switching Frequency
          2. 8.3.1.1.2 Spread Spectrum and External SYNC
          3. 8.3.1.1.3 Recommended Component Value and Internal Parameters
          4. 8.3.1.1.4 DC-DC Converter Switching Current Limit
          5. 8.3.1.1.5 DC-DC Converter Light Load Mode
        2. 8.3.1.2 Adaptive Voltage Control
          1. 8.3.1.2.1 Using Two-Divider
          2. 8.3.1.2.2 Using T-Divider
          3. 8.3.1.2.3 Feedback Capacitor
      2. 8.3.2 Internal LDO
      3. 8.3.3 LED Current Sinks
        1. 8.3.3.1 LED Output Configuration
        2. 8.3.3.2 LED Current Setting
        3. 8.3.3.3 Brightness Control
      4. 8.3.4 Protection and Fault Detections
        1. 8.3.4.1 Supply Fault and Protection
          1. 8.3.4.1.1 VIN Undervoltage Fault (VIN_UVLO)
          2. 8.3.4.1.2 VIN Overvoltage Fault (VIN_OVP)
        2. 8.3.4.2 Boost Fault and Protection
          1. 8.3.4.2.1 Boost Overvoltage Fault (BST_OVP)
          2. 8.3.4.2.2 SW Overvoltage Fault (SW_OVP)
        3. 8.3.4.3 LED Fault and Protection
          1. 8.3.4.3.1 LED Open Fault (LED_OPEN)
          2. 8.3.4.3.2 LED Short Fault (LED_SHORT)
        4. 8.3.4.4 Thermal Fault and Protection (TSD)
        5. 8.3.4.5 Overview of the Fault and Protection Schemes
    4. 8.4 Device Functional Modes
      1. 8.4.1 STANDBY State
      2. 8.4.2 SOFT START State
      3. 8.4.3 BOOST START State
      4. 8.4.4 NORMAL State
      5. 8.4.5 FAULT RECOVERY State
      6. 8.4.6 State Diagram and Timing Diagram for Start-up and Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Application for 4 LED Strings
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Inductor Selection
          2. 9.2.1.2.2 Output Capacitor Selection
          3. 9.2.1.2.3 Input Capacitor Selection
          4. 9.2.1.2.4 LDO Output Capacitor
          5. 9.2.1.2.5 Diode
        3. 9.2.1.3 Application Curves
      2. 9.2.2 SEPIC Mode Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Inductor
          2. 9.2.2.2.2 Diode
          3. 9.2.2.2.3 Capacitor C1
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.3.4.5 Overview of the Fault and Protection Schemes

A summary of the LP886xC-Q1 fault detection behavior is shown in Table 3. Detected faults (excluding LED open or short) cause device to enter FAULT RECOVERY state. In FAULT_RECOVERY the DC-DC and LED current sinks of the device are disabled, and the FAULT pin is pulled low. The device will exit FAULT RECOVERY mode after 100 ms and try the start-up sequence again. When recovery is successful and device enters into NORMAL state, the FAULT pin is released high.

Table 3. Fault Detections

FAULT/
PROTECTION 		FAULT NAME CONDITION FAULT PIN Enter FAULT_
RECOVERY
STATE		 ACTIVE STATE ACTION
VIN overvoltage protection VIN_OVP VIN > 42 V
Yes Yes SOFT START, BOOST START, NORMAL Device enters into FAULT RECOVERY state, and restarts after 100 ms
VIN undervoltage protection VIN_UVLO Effective when VIN < 3.85 V
Released when VIN >4 V 		Yes Yes SOFT START, BOOST START, NORMAL Device enters into FAULT RECOVERY state, and restarts after 100 ms
Open LED fault LED _OPEN Adaptive Voltage is max. and
any OUTx voltage < 0.9 V		 Yes No NORMAL Open string is removed from the DC-DC voltage control loop and output is disabled.
Fault pin low could be released by toggling VDDIO/EN pin, If VDDIO/EN is low for a period of 2 µs to 20 µs, LEDs are turned off for this period but device stays in NORMAL.
Shorted LED fault LED_SHORT One of OUTx voltage is [0.9 V, 1.9 V] and
any OUTx voltage > 6 V		 Yes No NORMAL Short string is removed from the DC-DC voltage control loop and output is disabled.
Fault pin low could be released by toggling VDDIO/EN pin, If VDDIO/EN is low for a period of 2 µs to 20 µs, LEDs are turned off for this period but device stays NORMAL.
Boost overvoltage protection BST_OVP VFB > 2.3 V Yes Yes NORMAL Fault is detected if boost overvoltage condition duration is more than 560 ms
Device enters into FAULT RECOVERY state, and restarts after 100 ms
SW overvoltage protection SW_OVP VSW > 49 V Yes Yes SOFT START, BOOST START, NORMAL Device enters into FAULT RECOVERY state, and restarts after 100 ms
Thermal protection TSD Effective when Tj > 165 ºC
Released when Tj < 145 ºC		 Yes Yes SOFT START, BOOST START, NORMAL Device enters into FAULT RECOVERY state, and restarts until TSD fault is released
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